Wafer And Integrated Circuits (IC) Shipping And Handling Market

By Component;

Shipping Containers, Pallets, Boxes, Bags, and Trays

By Operation Type;

Cold Chain Shipping, Ambient Shipping, Dry Shipping, and ESD Packaging

By Product;

IC Shipping Tubes, IC Trays, Carrier Tapes, and Others

By Application;

Wafer Fabrication, Integrated Circuit Manufacturing, Research & Development, Testing, and Assembly

By End-Use Industry;

Semiconductors, Electronics, Automotive, Aerospace, and Consumer Electronics

By Geography;

North America, Europe, Asia Pacific, Middle East & Africa, and Latin America - Report Timeline (2021 - 2031)
Report ID: Rn163624297 Published Date: June, 2025 Updated Date: July, 2025

Introduction

Global Wafer And Integrated Circuits (Ic) Shipping & Handling Market (USD Million), 2021 - 2031

In the year 2024, the Global Wafer And Integrated Circuits (Ic) Shipping & Handling Market was valued at USD 9,758.77 million. The size of this market is expected to increase to USD 15,876.64 million by the year 2031, while growing at a Compounded Annual Growth Rate (CAGR) of 7.2%.


Wafer And Integrated Circuits (IC) Shipping And Handling Market

*Market size in USD million

CAGR 7.2 %


Study Period2025 - 2031
Base Year2024
CAGR (%)7.2 %
Market Size (2024)USD 9,758.77 Million
Market Size (2031)USD 15,876.64 Million
Market ConcentrationMedium
Report Pages374
9,758.77
2024
15,876.64
2031

Major Players

  • ePAK International Inc.
  • Ted Pella
  • Inc
  • TSMC
  • Global Foundry
  • Intel
  • Broadcom

Market Concentration

Consolidated - Market dominated by 1 - 5 major players

Wafer And Integrated Circuits (IC) Shipping And Handling Market

Fragmented - Highly competitive market without dominant players


The global market for wafer and integrated circuits (IC) shipping and handling has seen substantial growth driven by the expanding IC market. This growth is fueled by rising demands from sectors like consumer electronics and communication systems. The products utilized in shipping are predominantly crafted from various plastic compounds like PE, PTFE, and HDPE, chosen for their antistatic properties and resistance to chemicals and heat. Their compact structure enhances durability, making them invaluable in the manufacturing of wafers and ICs.

Taiwan emerges as a significant player in this industry, contributing over 20% of global production due to its abundance of manufacturing facilities and the presence of key IC chip manufacturers such as TSMC. TSMC, the largest consumer of shipping and handling products, serves as a hub for many leading fabless manufacturers who outsource their fabrication processes to the company. This concentration of manufacturing prowess underscores Taiwan's importance in the global supply chain.

Developing nations like China, Brazil, and Israel are actively investing in their manufacturing sectors to attract global players, particularly in electronics and related industries. This strategic focus is expected to drive substantial demand for shipping and handling products in these regions in the foreseeable future.

  1. Introduction
    1. Research Objectives and Assumptions
    2. Research Methodology
    3. Abbreviations
  2. Market Definition & Study Scope
  3. Executive Summary
    1. Market Snapshot, By Component
    2. Market Snapshot, By Operation Type
    3. Market Snapshot, By Product
    4. Market Snapshot, ByApplication
    5. Market Snapshot, By End-Use Industry
    6. Market Snapshot, By Region
  4. Wafer And Integrated Circuits (Ic) Shipping & Handling Market Dynamics
    1. Drivers, Restraints and Opportunities
      1. Drivers
        1. IC Market Growth
        2. Consumer Electronics
        3. Communication Systems
        4. Plastic Compounds (PE, PTFE, HDPE)
      2. Restraints
        1. Environmental regulations
        2. Material costs
        3. Supply chain disruptions
        4. Technological complexity
      3. Opportunities
        1. Expansion of IC Market
        2. Technological Advancements
        3. Emerging Markets
        4. Sustainable Solutions
    2. PEST Analysis
      1. Political Analysis
      2. Economic Analysis
      3. Social Analysis
      4. Technological Analysis
    3. Porter's Analysis
      1. Bargaining Power of Suppliers
      2. Bargaining Power of Buyers
      3. Threat of Substitutes
      4. Threat of New Entrants
      5. Competitive Rivalry
  5. Market Segmentation
    1. Wafer And Integrated Circuits (Ic) Shipping & Handling Market, By Component, 2021 - 2031 (USD Million)

      1. Shipping Containers

      2. Pallets

      3. Boxes

      4. Bags

      5. Trays

    2. Wafer And Integrated Circuits (Ic) Shipping & Handling Market, By Operation Type, 2021 - 2031 (USD Million)

      1. Cold Chain Shipping

      2. Ambient Shipping

      3. Dry Shippin

      4. ESD Packaging

    3. Wafer And Integrated Circuits (Ic) Shipping & Handling Market, By Product, 2021 - 2031 (USD Million)
      1. IC Shipping Tubes
      2. IC Trays
      3. Carrier Tapes
      4. Others
    4. Wafer And Integrated Circuits (Ic) Shipping & Handling Market, By Application, 2021 - 2031 (USD Million)

      1. Wafer Fabrication

      2. Integrated Circuit Manufacturing

      3. Research & Development

      4. Testing

      5. Assembly

    5. Wafer And Integrated Circuits (Ic) Shipping & Handling Market, By End-Use Industry, 2021 - 2031 (USD Million)

      1. Semiconductors

      2. Electronics

      3. Automotive

      4. Aerospace

      5. Consumer Electronics

    6. Wafer And Integrated Circuits (Ic) Shipping & Handling Market, By Geography, 2021 - 2031 (USD Million)
      1. North America
        1. United States
        2. Canada
      2. Europe
        1. Germany
        2. United Kingdom
        3. France
        4. Italy
        5. Spain
        6. Nordic
        7. Benelux
        8. Rest of Europe
      3. Asia Pacific
        1. Japan
        2. China
        3. India
        4. Australia & New Zealand
        5. South Korea
        6. ASEAN (Association of South East Asian Countries)
        7. Rest of Asia Pacific
      4. Middle East & Africa
        1. GCC
        2. Israel
        3. South Africa
        4. Rest of Middle East & Africa
      5. Latin America
        1. Brazil
        2. Mexico
        3. Argentina
        4. Rest of Latin America
  6. Competitive Landscape
    1. Company Profiles
      1. ePAK International Inc.
      2. Ted Pella
      3. Inc
      4. TSMC
      5. Global Foundry
      6. Intel
      7. Broadcom
  7. Analyst Views
  8. Future Outlook of the Market