Semiconductor Assembly and Packaging Services Market

By Service Type;

Assembly Services and Testing Services

By Packaging;

WLP and Die Level Packaging

By Service Provider;

OSATs, IDMs, and Foundries

By Application;

Communication Sector, Computing & Networking Sector, Industrial & Automotive Sector, and Consumer Electronics Sector

By Geography;

North America, Europe, Asia Pacific, Middle East & Africa, and Latin America - Report Timeline (2021 - 2031)
Report ID: Rn789606734 Published Date: June, 2025 Updated Date: July, 2025

Semiconductor Assembly and Packaging Services Market Overview

Semiconductor Assembly and Packaging Services Market (USD Million)

Semiconductor Assembly and Packaging Services Market was valued at USD 7,279.83 million in the year 2024. The size of this market is expected to increase to USD 10,107.65 million by the year 2031, while growing at a Compounded Annual Growth Rate (CAGR) of 4.8%.


Semiconductor Assembly and Packaging Services Market

*Market size in USD million

CAGR 4.8 %


Study Period2025 - 2031
Base Year2024
CAGR (%)4.8 %
Market Size (2024)USD 7,279.83 Million
Market Size (2031)USD 10,107.65 Million
Market ConcentrationHigh
Report Pages324
7,279.83
2024
10,107.65
2031

Major Players

  • ASE Group, Inc.
  • Amkor Technology, Inc.
  • Siliconware Precision Industries Co., Ltd.
  • Powertech Technology, Inc.
  • United Test and Assembly Center Ltd.
  • JCET Group Co Ltd
  • ChipMOS Technologies
  • Jiangsu Changjiang Electronics Technology Co., Ltd.
  • Chipbond Technology Corporation.
  • Global Foundaries Inc.
  • CORWIL Technology Corp.
  • Thinklogical (Belden Inc.)
  • Tripp Lite

Market Concentration

Consolidated - Market dominated by 1 - 5 major players

Semiconductor Assembly and Packaging Services Market

Fragmented - Highly competitive market without dominant players


The Semiconductor Assembly and Packaging Services Market is undergoing rapid transformation, driven by rising demand for compact and high-efficiency electronic devices. Over 65% of semiconductor firms are now relying on external packaging and testing solutions to improve time-to-delivery and streamline production. This evolution is opening up vast opportunities for strategic collaboration and service innovation throughout the ecosystem.

Shift Toward Advanced Packaging
Approximately 58% of the market is transitioning to next-generation packaging technologies such as 3D integration and fan-out wafer-level packaging. These methods offer performance benefits while maintaining compact designs, making them highly attractive for high-end computing. The trend is also pushing service providers to form strategic partnerships and mergers, driving continuous growth and efficiency across applications.

Impact of IoT and AI
With over 62% of contracts now tailored to advanced chipsets for IoT and AI, packaging services are evolving to meet new requirements for performance and speed. This shift is promoting fresh strategies in heterogeneous integration, fostering a landscape of persistent technological advancements. The market is becoming increasingly dynamic, fueled by design complexity and functionality expectations.

Automation and Innovation Growth
More than 60% of assembly and packaging services now use AI-powered automation to enhance process accuracy and speed. This integration is significantly boosting innovation and reinforcing the importance of smart packaging in semiconductor development. With rising investment and ongoing modernization, the market is on a clear trajectory of accelerated growth and expanded capabilities.

  1. Introduction
    1. Research Objectives and Assumptions
    2. Research Methodology
    3. Abbreviations
  2. Market Definition & Study Scope
  3. Executive Summary
    1. Market Snapshot, By Service Type
    2. Market Snapshot, By Packaging
    3. Market Snapshot, By Service Provider
    4. Market Snapshot, By Application
    5. Market Snapshot, By Region
  4. Semiconductor Assembly and Packaging Services Market Dynamics
    1. Drivers, Restraints and Opportunities
      1. Drivers
        1. Demand for advanced consumer electronics packaging
        2. Growth of IoT and connected devices
        3. Adoption of 5G technology
        4. Expansion of automotive electronics
        5. Shift towards smaller form factors
      2. Restraints
        1. Complexity in heterogeneous integration
        2. IP protection concerns
        3. Limited skilled workforce
        4. Thermal management challenges
        5. Quality and reliability concerns
      3. Opportunities
        1. Growth of smart manufacturing
        2. Demand in medical electronics
        3. Adoption in aerospace and defense
        4. Development of 3D packaging
        5. Integration of security features
    2. PEST Analysis
      1. Political Analysis
      2. Economic Analysis
      3. Social Analysis
      4. Technological Analysis
    3. Porter's Analysis
      1. Bargaining Power of Suppliers
      2. Bargaining Power of Buyers
      3. Threat of Substitutes
      4. Threat of New Entrants
      5. Competitive Rivalry
  5. Market Segmentation
    1. Semiconductor Assembly and Packaging Services Market, By Application, 2021 - 2031 (USD Million)

      1. Assembly services

      2. Testing services

    2. Semiconductor Assembly and Packaging Services Market, By Packaging, 2021 - 2031 (USD Million)

      1. Die Level Packaging
      2. WLP
    3. Semiconductor Assembly and Packaging Services Market, By Service Provider, 2021 - 2031 (USD Million)
      1. OSATs
      2. IDMs
      3. Foundries
    4. Semiconductor Assembly and Packaging Services Market, By Application, 2021 - 2031 (USD Million)

      1. Communication Sector

      2. Computing & Networking Sector

      3. Industrial & Automotive Sector

      4. Consumer Electronics Sector

    5. Semiconductor Assembly and Packaging Services Market, By Geography, 2021 - 2031 (USD Million)
      1. North America
        1. United States
        2. Canada
      2. Europe
        1. Germany
        2. United Kingdom
        3. France
        4. Italy
        5. Spain
        6. Nordic
        7. Benelux
        8. Rest of Europe
      3. Asia Pacific
        1. Japan
        2. China
        3. India
        4. Australia & New Zealand
        5. South Korea
        6. ASEAN (Association of South East Asian Countries)
        7. Rest of Asia Pacific
      4. Middle East & Africa
        1. GCC
        2. Israel
        3. South Africa
        4. Rest of Middle East & Africa
      5. Latin America
        1. Brazil
        2. Mexico
        3. Argentina
        4. Rest of Latin America
  6. Competitive Landscape
    1. Company Profiles
      1. ASE Group, Inc.
      2. Amkor Technology, Inc.
      3. Siliconware Precision Industries Co., Ltd.
      4. Powertech Technology, Inc.
      5. United Test and Assembly Center Ltd.
      6. JCET Group Co Ltd
      7. ChipMOS Technologies
      8. Jiangsu Changjiang Electronics Technology Co., Ltd.
      9. Chipbond Technology Corporation.
      10. Global Foundaries Inc.
      11. CORWIL Technology Corp.
      12. Thinklogical (Belden Inc.)
      13. Tripp Lite
  7. Analyst Views
  8. Future Outlook of the Market