Non Ultraviolet (UV) Dicing Tape Market

• In November 2023, Lintec launched a high-adhesion non-UV dicing tape for precise semiconductor wafer processing.

• In June 2023, Nitto Denko introduced an eco-friendly non-UV dicing tape with enhanced thermal resistance for microelectronics.

This comprehensive report on the Global Non-UV Dicing Tape Market meticulously examines various segments to offer a detailed analysis enriched with revenue insights spanning historic and forecast periods. Each market segment, including material type, thickness, and application, undergoes thorough scrutiny backed by substantial data points.

For material types such as PVC, PET, PO, and others, the analysis delves into their respective market shares, growth trajectories, and key drivers influencing adoption across semiconductor manufacturing. Detailed revenue analyses illustrate how these materials cater to diverse industry needs, from standard applications to specialized requirements like high-temperature resistance or optical clarity.

Similarly, the segmentation by thickness (85-125 micron, 126-150 micron, below 85 micron, and above 150 micron) elucidates trends in wafer handling capabilities, adhesive strengths, and suitability for various semiconductor processes. Insights derived from revenue analyses highlight the growing preference for thinner tapes in ultra-thin wafer applications and the robust demand for thicker tapes in heavy-duty semiconductor packaging.

The segmentation by application (single-sided and double-sided) provides nuanced perspectives on the operational efficiencies and precision enabled by different tape configurations. Revenue analyses not only quantify market opportunities but also uncover emerging trends in advanced packaging technologies that necessitate dual-sided tape solutions for enhanced wafer handling and mounting stability.

Global Non-Uv Dicing Tape Segment Analysis

In this report, the Global Non-Uv Dicing Tape Market has been segmented by Material Type, Thickness, Application and Geography.

Global Non-Uv Dicing Tape Market, Segmentation by Material Type

the Global Non-Uv Dicing Tape Market has been segmented by Material Type into PVC (Polyvinyl chloride), PET (Polyethylene terephthalate), PO and Others

PVC (Polyvinyl Chloride) dicing tapes are favored in the semiconductor industry for their robust adhesive properties and durability. These tapes provide strong adhesion to semiconductor wafers, ensuring secure mounting during the dicing process. PVC tapes offer excellent thermal stability, maintaining their performance across a wide range of temperatures encountered during semiconductor fabrication. This characteristic is crucial in maintaining the integrity of delicate wafers throughout handling and processing stages.

Moreover, PVC tapes are versatile and suitable for various semiconductor packaging applications due to their ability to adhere well to different surfaces and substrates commonly used in semiconductor manufacturing. Their durability ensures reliable performance, minimizing the risk of tape failure or detachment during critical processing steps.

PET (Polyethylene Terephthalate) tapes are renowned for their high tensile strength and optical clarity, making them ideal for applications demanding precision and reliability. PET tapes provide a strong yet flexible support for semiconductor wafers, allowing for precise dicing without compromising on the integrity of the wafer surface. Their optical clarity is advantageous in applications where visibility of the underlying features or markings on the wafer is essential for alignment and inspection processes.

Additionally, PET tapes exhibit excellent resistance to tearing and stretching, ensuring consistent performance in high-stress environments typical of semiconductor manufacturing. Their high tensile strength enables them to withstand the rigors of handling and processing, contributing to improved yield rates and reduced production downtime.

PO (Polyolefin) and other specialized tapes encompass a range of materials tailored to specific semiconductor manufacturing needs. These tapes may offer properties such as enhanced chemical resistance, crucial for applications involving exposure to harsh etching or cleaning solutions. Furthermore, some formulations excel in ultra-high temperature environments, maintaining adhesive strength and stability under extreme processing conditions.

Global Non-Uv Dicing Tape Market, Segmentation by Thickness

the Global Non-Uv Dicing Tape Market has been segmented by Thickness Type into 85-125 micron, 126-150 micron, below 85 micron and above 150 micron

The segmentation of dicing tapes based on thickness plays a critical role in semiconductor manufacturing, addressing specific needs across various stages of the production process:

85-125 micron: Dicing tapes within this range are prized for their ability to strike a balance between flexibility and strength. They are ideally suited for standard semiconductor wafer handling and dicing processes where moderate adhesion strength and flexibility are required. These tapes ensure secure mounting of the wafer during dicing while allowing for easy removal afterward, minimizing the risk of damage to the delicate semiconductor materials. Manufacturers prefer tapes in this thickness range for their versatility in accommodating different wafer sizes and shapes, thereby supporting efficient and reliable production workflows.

126-150 micron: Thicker dicing tapes in this category are chosen for their enhanced durability and superior adhesive strength. They are specifically designed to handle larger or heavier wafers that require robust adhesion throughout the dicing and subsequent processing stages. The increased thickness provides added protection against mechanical stresses and ensures secure fixation of the wafer during intricate cutting processes. These tapes are critical in applications where stability and reliability are paramount, such as in the production of high-density integrated circuits and advanced semiconductor packaging technologies.

Below 85 micron: Thin dicing tapes are engineered to cater to the growing demand for ultra-thin wafer handling in semiconductor manufacturing. These tapes offer minimal thickness to reduce the overall profile of the mounted wafer, thereby enhancing precision and minimizing material wastage during the dicing process. Their primary advantage lies in providing precise control over the dicing operation, ensuring clean and accurate cuts without compromising on the integrity of the semiconductor material. Thin tapes also facilitate efficient handling of extremely delicate wafers, making them indispensable in industries pushing the boundaries of miniaturization and high-performance computing.

Above 150 micron: Dicing tapes exceeding 150 microns in thickness are tailored to meet the rigorous demands of semiconductor packaging applications that require extra protection and robust adhesion strength. These tapes offer substantial thickness to withstand harsh processing conditions and provide reliable support for heavy-duty wafers used in advanced packaging technologies. They are essential in safeguarding the integrity of sensitive semiconductor components during handling, transportation, and assembly stages. The increased thickness enhances the tapes' ability to absorb mechanical shocks and vibrations, ensuring the secure attachment of wafers in critical manufacturing environments.

Global Non-Uv Dicing Tape Market, Segmentation by Application

the Global Non-Uv Dicing Tape Market has been segmented by Application Type intosingle sided and double sided

Single-sided and double-sided dicing tapes serve distinct purposes in semiconductor manufacturing, each tailored to specific requirements and applications.

Single Sided Tapes: These tapes are designed to securely hold semiconductor wafers in place during the dicing process, where only one side of the wafer is diced. The adhesive strength of single-sided tapes is crucial in preventing movement or shifting of the wafer during dicing, which is essential for maintaining precision and minimizing the risk of damage. These tapes provide a stable platform for the dicing blade to cut through the wafer without compromising the integrity of the semiconductor material. Single-sided tapes are typically used in standard semiconductor packaging processes where precise alignment and minimal handling stress are critical to ensure the quality and reliability of the diced wafers.

Double Sided Tapes: In contrast, double-sided dicing tapes offer adhesive properties on both sides, enabling secure mounting of the wafer for dicing and subsequent processing steps. These tapes are particularly advantageous in applications requiring higher stability and precision, such as advanced packaging technologies and multi-step fabrication processes. By adhering to both the wafer and the mounting surface (such as a dicing frame or carrier), double-sided tapes enhance the overall stability and alignment of the wafer throughout the manufacturing process. This ensures consistent dicing accuracy and minimizes the risk of wafer movement or misalignment during handling and processing. Moreover, double-sided tapes facilitate efficient processing workflows by securely holding the wafer in place during subsequent steps like cleaning, inspection, and packaging, thereby optimizing production yields and throughput in semiconductor manufacturing facilities.

Both single-sided and double-sided dicing tapes play critical roles in semiconductor fabrication, offering solutions that cater to specific needs for precision, reliability, and efficiency in wafer handling and processing. The choice between these tapes depends on the specific requirements of the application, including the type of semiconductor material, the complexity of the dicing process, and the desired outcomes in terms of yield and product quality.

Global Non-Uv Dicing Tape Market, Segmentation by Geography

In this report, the Global Non-Uv Dicing Tape Market has been segmented by Geography into five regions; North America, Europe, Asia Pacific, Middle East and Africa and Latin America.

Global Non-Uv Dicing Tape Market Share (%), by Geographical Region, 2024

North America: In North America, the market share is driven by the strong presence of semiconductor manufacturers and research institutions focused on semiconductor technologies. The region benefits from a robust ecosystem supporting technological innovation and adoption of advanced packaging solutions.

Asia-Pacific: Asia-Pacific holds a significant share due to the concentration of semiconductor foundries and assembly facilities in countries like China, Taiwan, South Korea, and Japan. These countries are leaders in semiconductor production, driving the demand for high-performance dicing tapes to support their manufacturing processes.

Europe: Europe also contributes to the market share with its semiconductor industry, though to a lesser extent compared to North America and Asia-Pacific. The region's focus on technological advancements and automotive electronics further fuels the demand for dicing tapes in specialized applications.

Other regions contribute to the market share with emerging semiconductor manufacturing capabilities and increasing investments in electronics production. However, the share is relatively smaller compared to the major regions due to varying levels of industrialization and technological adoption.

This report provides an in depth analysis of various factors that impact the dynamics of Global Non-Uv Dicing Tape Market. These factors include; Market Drivers, Restraints and Opportunities Analysis.

Drivers, Restraints and Opportunity Analysis

Drivers:

• Increasing Semiconductor Demand
• Advanced Packaging Technologies
• Growing Electronics Industry
• Enhanced Wafer Protection

• Demand for Thin Wafers - The demand for thin wafers is a significant driver propelling the growth of the global non-UV dicing tape market. As semiconductor technology advances, there is a continuous trend towards thinner wafers to accommodate the shrinking size and increasing functionality of electronic devices. Thin wafers enable higher packing densities and improve the performance of integrated circuits, thereby meeting the demands of modern consumer electronics, automotive applications, and industrial equipment.

  Non-UV dicing tapes play a crucial role in this trend by providing reliable support and protection during the dicing process of these thinner wafers. These tapes ensure that delicate and ultra-thin wafers remain intact and undamaged, reducing the risk of breakage or contamination during handling and transportation within the semiconductor fabrication facilities.

  Manufacturers of non-UV dicing tapes are increasingly focusing on developing tapes that offer superior adhesion strength and thermal stability to meet the specific requirements of thin wafer handling. This includes enhancements in adhesive formulations and material properties that can withstand the rigors of semiconductor processing, including high-temperature environments and exposure to chemicals used in etching and cleaning processes.

Restraints:

• Technological Complexity
• Limited Adoption Rate
• Regulatory Challenges
• Material Compatibility Issues

• Supply Chain Disruptions - Supply chain disruptions pose a significant restraint to the global non-UV dicing tape market, impacting the availability and delivery of critical materials and components essential for tape manufacturing. These disruptions can arise from various factors, including geopolitical tensions, natural disasters, transportation bottlenecks, and regulatory changes affecting international trade.

  The complexity of the supply chain in the semiconductor industry further exacerbates these challenges, as manufacturers of non-UV dicing tapes rely on a network of global suppliers for raw materials, adhesives, and specialized components. Any disruption along this supply chain can lead to delays in production, increased costs, and uncertainty in meeting customer demand.

  Additionally, the reliance on just-in-time inventory management practices within the semiconductor sector heightens the vulnerability to supply chain disruptions. Even minor delays or shortages of critical materials can ripple through the supply chain, causing disruptions in manufacturing schedules and impacting overall operational efficiency.

  Mitigating supply chain risks requires proactive strategies such as diversifying supplier networks, establishing strategic partnerships, and implementing robust contingency plans to ensure continuity of supply. However, these measures often entail additional costs and resource allocation, which can strain profitability and competitiveness in the market.

Opportunities:

• Emerging Markets Expansion
• Innovations in Materials
• Automation Integration
• Industry 4.0 Trends

• Strategic Partnerships - Strategic partnerships play a crucial role in the Global Non-UV Dicing Tape Market by fostering collaboration between key industry players, enhancing technological capabilities, and expanding market reach. These partnerships are formed between dicing tape manufacturers, semiconductor equipment suppliers, and semiconductor manufacturers themselves, aiming to leverage each other's strengths to drive innovation and market growth.

  In the context of dicing tape manufacturers, strategic partnerships often involve collaboration with semiconductor equipment suppliers to co-develop advanced dicing tape technologies. This collaboration allows for the integration of dicing tapes with cutting-edge semiconductor manufacturing equipment, ensuring compatibility and optimal performance in semiconductor fabrication processes. By working closely with equipment suppliers, dicing tape manufacturers can tailor their products to meet the specific requirements of next-generation semiconductor devices, such as those used in 5G technology, artificial intelligence (AI), and automotive electronics.

  Moreover, strategic partnerships enable dicing tape manufacturers to access new markets and customer segments through alliances with semiconductor manufacturers. These partnerships facilitate joint marketing efforts, technical support, and customization of dicing tapes to address the unique needs of different semiconductor applications. By aligning their capabilities and resources, manufacturers can strengthen their market position and enhance their competitive advantage in the rapidly evolving semiconductor industry.

Key players in Global Non-Uv Dicing Tape Market include:

• Pantech Tape
• Furukawa Electric
• Mitsui Chemicals
• AI Technology
• Lintec Corporation
• QES Group Berhad
• AMC Co.,Ltd
• Airy Technology

In this report, the profile of each market player provides following information:

• Company Overview and Product Portfolio
• Key Developments
• Financial Overview
• Strategies
• Company SWOT Analysis