Next Generation Non Volatile Memory Market
By Memory Type;
Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM)By Wafer Size;
200 mm and 300 mmBy Application;
BFSI, Consumer Electronics, Government, Telecommunications, Information Technology and OthersBy Geography;
North America, Europe, Asia Pacific, Middle East & Africa and Latin America - Report Timeline (2021 - 2031)Next Generation Non Volatile Memory Market Overview
Next Generation Non Volatile Memory Market (USD Million)
Next Generation Non Volatile Memory Market was valued at USD 1,027.79 million in the year 2024. The size of this market is expected to increase to USD 1,716.28 million by the year 2031, while growing at a Compounded Annual Growth Rate (CAGR) of x.x%
Next Generation Non Volatile Memory Market
*Market size in USD million
CAGR 7.6 %
Study Period | 2025 - 2031 |
---|---|
Base Year | 2024 |
CAGR (%) | 7.6 % |
Market Size (2024) | USD 1,027.79 Million |
Market Size (2031) | USD 1,716.28 Million |
Market Concentration | Medium |
Report Pages | 362 |
Major Players
- Applied Materials, Inc
- Capres A/S
- Everspin Technologies Inc
- Canon Anelva Corporation
- Avalanche Technology
- 4DS Memory Ltd.
- Crossbar Inc.
- Crocus Nanoelectronics
- Cobham Advanced Electronic Solutions, Inc.
- Antaios
- Blueshift Memory
- Advanced Memory Technology
- Fraunhofer Institute for Photonic Microsystems IPMS Center Nanoelectronic Technologies (CNT)
- DXCorr Design Inc
- California Memory Technologies
Market Concentration
Consolidated - Market dominated by 1 - 5 major players
Next Generation Non Volatile Memory Market
Fragmented - Highly competitive market without dominant players
The Next Generation Non Volatile Memory Market is gaining momentum as industries demand faster, more efficient, and scalable storage solutions. With around 45% of storage advancements now linked to these technologies, they are redefining data retention and access. Their ability to provide high-density storage, reduced latency, and long endurance makes them essential for modern computing needs.
Technological Innovations
Advances in Resistive RAM (ReRAM), Phase-Change Memory (PCM), and MRAM are driving adoption across high-performance systems. Nearly half of next-gen computing platforms already rely on these technologies for speed, reliability, and energy efficiency. Their capability to enable real-time analytics and ultra-low power consumption ensures strong relevance in emerging digital applications.
Efficiency and Performance
These solutions enable up to 35% lower power usage compared to conventional memory. Features like scalability, high durability, and faster operations are ensuring that industries can handle growing data loads while supporting sustainable operations.
Expanding Applications
Over 60% of AI-driven devices integrate advanced non-volatile memory for enhanced performance. Its deployment in IoT ecosystems, consumer electronics, cloud environments, and automotive applications shows the wide utility of these technologies across critical industries.
Future Integration
More than 55% of electronic systems are expected to adopt next-gen non-volatile memory. Whether in autonomous systems, large-scale data centers, or next-gen connectivity platforms, these solutions will enable greater efficiency, stronger reliability, and accelerated performance, establishing them as central to digital transformation.
Next Generation Non Volatile Memory Market Recent Developments
-
In October 2023, Micron Technology partnered with Qualcomm Technologies to develop 5X LPDDR5X memory for enhanced AI performance. This collaboration aimed at leveraging Qualcomm's Snapdragon 8 Gen 3 mobile platform to offer a significant boost in data speed, operating at 9.6 Gbps. This development highlights the growing integration of memory technologies with artificial intelligence (AI) application.
-
In September 2023, Microchip Technology’s subsidiary, Silicon Storage Technology, partnered with GlobalFoundries to introduce the third-generation embedded SuperFlash NVM solution. This partnership focused on advancing memory technologies for embedded systems, showcasing the continuous push towards higher efficiency and performance in memory devices
Segment Analysis
The global next-generation non-volatile memory market is poised for significant advancements, driven by the increasing demand for faster, more efficient, and durable memory solutions across various applications. The primary products in this market include Ferroelectric RAM (FeRAM), Phase Change Memory (PCM), Magnetoresistive RAM (MRAM), and Resistive RAM (ReRAM), each offering unique benefits in terms of speed, power consumption, and data retention. These memory types are critical in enabling the development of faster and more reliable devices, making them a cornerstone of next-generation computing.
In terms of memory architecture, the market features technologies such as Hybrid Memory Cube (HMC) and High-bandwidth Memory (HBM). These memory architectures are designed to provide high-performance, low-latency, and power-efficient solutions, especially for high-demand applications such as gaming, artificial intelligence, and big data processing. Additionally, wafer size plays an important role in the manufacturing process, with 200 mm and 300 mm wafers being the standard sizes used in the production of next-gen non-volatile memory devices, affecting the yield and performance of memory chips.
The applications of next-generation non-volatile memory span several industries, including mobile phones, cache memory, enterprise storage, industrial and automotive systems, mass storage, and embedded microcontroller units (MCUs) and smart cards. These memory solutions are utilized by a wide range of end-users such as banking, financial services, and insurance (BFSI), consumer electronics, government, telecommunications, information technology, and other sectors. Geographically, the market is distributed across North America, Europe, Asia Pacific, the Middle East & Africa, and Latin America, with the Asia Pacific region being a major hub for semiconductor production and innovation in memory technologies.
Global Next Generation Non Volatile Memory Segment Analysis
The Global Next Generation Non Volatile Memory Market Has Been Segmented By Product, Type, Wafer Size, Application, End-User and Geography.
Global Next Generation Non Volatile Memory Market, Segmentation by Product
The Global Next Generation Non Volatile Memory Market Has Been Segmented By Product into FeRAM, PCM, MRAM and ReRAM.
FeRAM, for instance, combines the fast read and write capabilities of DRAM with the non-volatility of flash memory, making it ideal for applications in smart cards, RFID systems, and automotive electronics. Its low power consumption and high endurance make it a strong contender in markets where energy efficiency and reliability are paramount.
Phase Change Memory (PCM) is another significant player in the NVM market. PCM leverages the unique properties of chalcogenide glass to switch between amorphous and crystalline states, representing binary data. This technology offers faster write speeds and better endurance compared to traditional flash memory. PCM's scalability and ability to operate at high temperatures make it particularly suited for applications in high-performance computing, mobile devices, and data centers. Its potential to serve as both main memory and storage further underscores its versatility and growing adoption in the market.
Magnetoresistive RAM (MRAM) and Resistive RAM (ReRAM) also hold promising futures within the NVM landscape. MRAM, which uses magnetic states to store data, boasts ultra-fast read and write speeds, infinite endurance, and non-volatility. These characteristics make it ideal for applications in aerospace, military, and enterprise storage. ReRAM, on the other hand, operates by changing the resistance across a dielectric solid-state material. Known for its low power consumption, high speed, and scalability, ReRAM is gaining traction in the fields of wearable technology, IoT devices, and neuromorphic computing. As the demand for advanced, reliable memory solutions continues to grow, the development and integration of these next-generation NVM technologies are expected to significantly impact various industries worldwide.
Global Next Generation Non Volatile Memory Market, Segmentation by Type
The Global Next Generation Non Volatile Memory Market Has Been Segmented By Type into Hybrid Memory Cube (HMC), and High-bandwidth Memory (HBM).
These architectures are designed to meet the increasing demand for faster, more efficient memory solutions, particularly in high-performance computing environments.
Hybrid Memory Cube (HMC) is a 3D memory technology that offers high-speed data processing with low power consumption, making it ideal for applications that require high throughput, such as gaming, big data analytics, and artificial intelligence. The stacked design of HMC allows for a smaller footprint and better energy efficiency compared to traditional memory architectures, enabling faster data transfers between processors and memory.
High-bandwidth Memory (HBM), on the other hand, is a memory technology that provides extremely high data transfer rates with lower energy consumption than traditional memory types. HBM achieves this by vertically stacking memory chips and connecting them via a silicon interposer. This technology is particularly suited for graphics cards, supercomputers, and high-performance processors, where bandwidth is crucial for handling large volumes of data quickly. Both HMC and HBM represent the future of memory technologies, addressing the need for more efficient and powerful memory solutions across a variety of industries.
Global Next Generation Non Volatile Memory Market, Segmentation by Wafer Size
The Global Next Generation Non Volatile Memory Market Has Been Segmented By Wafer Size into 200 mm and 300 mm.
In the global next-generation non-volatile memory market, wafer size plays a crucial role in determining the manufacturing efficiency, cost, and performance of memory devices. The two primary wafer sizes used in semiconductor fabrication are 200 mm and 300 mm, with each having its own set of advantages and applications.
200 mm wafers are typically used for smaller-scale production runs, where cost-effectiveness and flexibility are key considerations. These wafers are common in the production of specialty memory devices or for technologies that have not yet scaled to mass production. They allow for precise control over individual chips, making them suitable for applications where high customization is needed. However, 200 mm wafers are less efficient in terms of the number of chips that can be produced per wafer compared to 300 mm wafers.
On the other hand, 300 mm wafers are the standard in high-volume manufacturing of next-generation non-volatile memory devices, including those used in advanced memory technologies like FeRAM, PCM, MRAM, and ReRAM. These wafers provide a higher yield of chips per wafer, which translates into lower production costs and better scalability for mass-market applications. The use of 300 mm wafers is more common in the production of mainstream consumer electronics, mobile devices, and enterprise storage systems, where high performance and large-scale production are essential.
Global Next Generation Non Volatile Memory Market, Segmentation by Application
The Global Next Generation Non Volatile Memory Market Has Been Segmented By Application into Mobile Phones, Cache Memory & Enterprise Storage, Industrial & Automotive, Mass Storage and Embedded MCU & Smart Cards.
The Global Next Generation Non-Volatile Memory (NVM) Market is experiencing significant growth due to the increasing demand for advanced memory solutions across various sectors. One of the key segments driving this market is mobile phones. As smartphones continue to evolve, there is a heightened need for faster, more efficient memory technologies that can handle complex applications and large amounts of data. Next generation NVM technologies, such as Resistive RAM (ReRAM), Magnetoresistive RAM (MRAM), and Phase Change Memory (PCM), offer higher speed, better endurance, and greater energy efficiency compared to traditional memory solutions. These characteristics make them ideal for mobile devices, where performance and power consumption are critical considerations.
Cache memory and enterprise storage represent another significant segment in the next generation NVM market. In enterprise environments, the ability to access data quickly and efficiently is paramount. Next generation NVM provides a viable solution for improving cache memory performance, which is essential for speeding up data retrieval processes. These advanced memory technologies are increasingly being integrated into enterprise storage systems to enhance data management and storage efficiency. The scalability and reliability of next generation NVM make it a valuable asset for businesses looking to optimize their data infrastructure and reduce latency issues, which are crucial for maintaining competitive advantage in data-intensive industries.
The industrial and automotive sectors are also driving the adoption of next generation NVM. In these industries, the demand for robust, durable, and high-performance memory solutions is critical for supporting a wide range of applications, from industrial automation systems to advanced driver-assistance systems (ADAS) and autonomous vehicles. Mass storage and embedded MCU & smart cards are additional areas where next generation NVM is making an impact. Mass storage solutions benefit from the enhanced storage capabilities and endurance of NVM technologies, while embedded systems and smart cards require reliable and secure memory solutions for various applications, including identification, security, and IoT devices. The broad applicability of next generation NVM across these diverse sectors underscores its potential to transform the memory market and meet the evolving needs of modern technology.
Global Next Generation Non Volatile Memory Market, Segmentation by End-User
The Global Next Generation Non Volatile Memory Market Has Been Segmented By End-User into BFSI, Consumer Electronics, Government, Telecommunications, Information Technology, and Others.
For end-users in the BFSI sector, the need for non-volatile memory solutions is particularly high, as financial institutions demand high-speed data access and security. Similarly, the consumer electronics sector benefits greatly from these memory solutions, enabling faster processing and more efficient storage for mobile devices, wearables, and smart home devices.
Government entities are increasingly adopting non-volatile memory technologies for secure data storage and rapid data retrieval in mission-critical applications. Telecommunications companies leverage these technologies to enhance network performance and manage large volumes of data efficiently. Information technology companies are integrating these memory solutions into cloud computing, data centers, and enterprise systems to support massive amounts of data storage and improve system response times.
Overall, industries such as BFSI, consumer electronics, government, telecommunications, and IT are focusing on next-generation non-volatile memory technologies to stay competitive and meet their data management and performance demands. These sectors are looking to leverage the capabilities of products like FeRAM, PCM, MRAM, and ReRAM, along with high-bandwidth memory solutions like Hybrid Memory Cube and High-Bandwidth Memory.
Global Next Generation Non Volatile Memory Market, Segmentation by Geography
The Global Next Generation Non Volatile Memory Market Has Been Segmented By Geography into five regions; North America, Europe, Asia Pacific, Middle East, Africa and Latin America.
Global Next Generation Non Volatile Memory Market Share (%), by Geographical Region, 2024
North America, the market is propelled by the presence of leading technology companies and a robust infrastructure supporting innovation. The United States, in particular, is a major hub for research and development in non-volatile memory technologies, with significant investments from both government and private sectors. The adoption of NVM in data centers and enterprise storage solutions is also a key driver in this region.
Europe is another critical region for the Next Generation NVM market, with countries like Germany, France, and the UK leading in technological advancements. The region's strong focus on industrial automation, automotive, and consumer electronics significantly contributes to the demand for advanced memory solutions. European companies are also heavily involved in the research and development of new memory technologies, fostering a competitive market landscape. Supportive government policies and collaborations between industry and academia enhance the growth prospects of the NVM market in this region.
Asia Pacific region, the Next Generation NVM market is witnessing rapid growth due to the region's booming electronics manufacturing sector. Countries such as China, Japan, South Korea, and Taiwan are at the forefront of semiconductor manufacturing and innovation. The high demand for consumer electronics, coupled with the increasing penetration of Internet of Things (IoT) devices, drives the need for efficient and reliable memory solutions.
Middle East and Africa, though smaller markets compared to North America, Europe, and Asia Pacific, show promising growth potential due to increasing technological adoption and investments in digital infrastructure. Latin America, with countries like Brazil and Mexico, is gradually emerging as a significant player, driven by the growing IT and telecommunications sectors and increasing adoption of advanced technologies in various industries.
Market Trends
This report provides an in depth analysis of various factors that impact the dynamics of Global Next Generation Non Volatile Memory Market. These factors include; Market Drivers, Restraints and Opportunities Analysis.
Drivers, Restraints and Opportunity Analysis
Drivers:
- Advancements in Quantum Computing
- Shift Towards 5G Technology and Networks
- Increased Demand for High-Performance Computing
-
Adoption of Memory Technologies in Aerospace and Defense: The aerospace and defense sectors are witnessing a paradigm shift with the adoption of advanced memory technologies, particularly non-volatile memory (NVM). As these industries increasingly rely on data-intensive applications, the demand for robust, high-speed, and reliable memory solutions has surged. Non-volatile memory technologies such as MRAM (Magnetoresistive RAM), ReRAM (Resistive RAM), and 3D XPoint are becoming critical due to their ability to retain data without power, offer fast read/write speeds, and provide greater endurance. These characteristics are essential for applications such as avionics, satellite communications, and tactical systems where data integrity and rapid access to information are paramount.
In aerospace applications, the need for advanced NVM solutions is driven by the requirements for data logging, navigation systems, and in-flight communication systems that must function flawlessly in harsh environments. Non-volatile memories provide the resilience and reliability needed to withstand extreme temperatures, vibrations, and radiation typically encountered in aerospace operations. For defense, NVM technologies are integral to mission-critical applications including real-time data processing in radar systems, secure communication, and enhanced battlefield situational awareness. The ability of these memories to operate under stringent conditions while ensuring data security and longevity makes them indispensable for defense applications.
The global next-generation non-volatile memory market is poised for significant growth, fueled by the technological advancements and increasing adoption in aerospace and defense. As these industries continue to innovate, the integration of sophisticated memory solutions is expected to enhance operational efficiency, reduce latency, and improve overall system performance. The push towards digital transformation and the Internet of Things (IoT) within these sectors is driving the demand for memory technologies that can support vast amounts of data and real-time analytics. Consequently, the investment in and development of advanced non-volatile memory technologies will likely accelerate, cementing their role as foundational components in the future landscape of aerospace and defense systems.
Restraints:
- Power Consumption Concerns
- Compatibility with Existing Systems
- Limited Data Retention and Durability
-
Regulatory and Compliance Challenges: The global next-generation non-volatile memory (NVM) market faces significant regulatory and compliance challenges due to the rapid evolution of technology and the diverse regulatory landscapes across different regions. One major challenge is adhering to varying standards and regulations regarding data security and privacy. Non-volatile memory technologies, such as Resistive RAM (ReRAM), Phase-Change Memory (PCM), and Magnetic RAM (MRAM), store data even when power is lost, which raises concerns about data protection and potential unauthorized access. Compliance with stringent regulations like the General Data Protection Regulation (GDPR) in Europe and the California Consumer Privacy Act (CCPA) in the United States necessitates robust data encryption and security protocols, which can increase development costs and complexity for manufacturers.
Another critical regulatory challenge is environmental compliance, as the production and disposal of electronic components, including NVM, are subject to strict environmental regulations. Regulations such as the Restriction of Hazardous Substances (RoHS) Directive and the Waste Electrical and Electronic Equipment (WEEE) Directive in the European Union mandate the reduction of hazardous substances and the proper disposal of electronic waste. Meeting these requirements involves adopting eco-friendly manufacturing processes and ensuring that materials used in NVM production are sustainable and recyclable. This not only impacts the supply chain but also requires continuous monitoring and adaptation to evolving environmental standards, potentially leading to increased operational costs.
The global nature of the next-generation NVM market means that companies must navigate a complex web of international trade regulations and export controls. Technologies involving advanced semiconductors and memory devices often fall under export control regulations due to their potential dual-use in civilian and military applications. For instance, the U.S. International Traffic in Arms Regulations (ITAR) and Export Administration Regulations (EAR) impose restrictions on the export of certain high-tech products, including advanced memory technologies. Compliance with these regulations requires detailed knowledge of export control laws and can limit market access, especially in regions with strict trade policies or geopolitical tensions. Companies must invest in compliance programs and legal expertise to manage these risks, ensuring that they can effectively navigate the global market while adhering to all relevant regulations.
Opportunities:
- Impact of Technological Alternatives
- Market Awareness and Adoption Rate
- Future Outlook and Potential Solutions
- Supply Chain and Raw Material Availability: The global next-generation non-volatile memory (NVM) market is deeply influenced by the complexities of its supply chain and the availability of raw materials. At the heart of this market are advanced materials such as phase-change materials, magnetic tunnel junctions, and various metal oxides, which are essential for technologies like Phase-Change Memory (PCM), Magnetoresistive RAM (MRAM), and Resistive RAM (ReRAM). The supply chain for these materials is global, involving multiple stages of processing and refinement before they are incorporated into semiconductor devices. The availability and stability of these raw materials are critical, as any disruption can significantly impact production timelines and costs. Companies in this sector must navigate challenges such as geopolitical tensions, trade policies, and environmental regulations that can affect the sourcing and cost of these materials.
The manufacturing process for next-generation NVMs is highly specialized and requires advanced fabrication facilities, often referred to as fabs, which are concentrated in specific regions like East Asia (notably Taiwan, South Korea, and Japan) and the United States. These fabs rely on a consistent and high-quality supply of raw materials, such as rare earth metals and highly purified chemicals, to maintain production yields and performance standards. The dependence on a few key suppliers or regions for critical materials poses a risk of supply chain bottlenecks. For instance, disruptions in the supply of rare earth elements, predominantly mined and processed in China, can have ripple effects across the entire semiconductor industry. Therefore, companies are increasingly looking to diversify their supply chains and invest in alternative materials and processes to mitigate these risks.
The environmental and ethical considerations surrounding the extraction and processing of raw materials are becoming more prominent. The next-generation NVM market must address concerns related to the environmental impact of mining activities and the ethical sourcing of materials, particularly in conflict regions. There is growing pressure from regulators and consumers for sustainable practices, which has led to increased scrutiny of supply chain operations. Companies are responding by adopting more stringent environmental standards and seeking certification for ethically sourced materials. This shift not only helps in securing a reliable supply of raw materials but also enhances the reputation and marketability of next-generation NVM products in an increasingly eco-conscious global market.
Next Generation Non Volatile Memory Market Competitive Landscape Analysis
Next Generation Non Volatile Memory Market is advancing rapidly as industries shift toward high-speed, energy-efficient, and scalable storage technologies. Companies are pursuing strategies through collaboration, targeted partnerships, and continuous innovation. With rising demand in data centers, automotive electronics, and consumer devices, the sector is set for sustained growth and competitive expansion.
Market Structure and Concentration
The market shows moderate concentration, with leading firms holding close to 30% of the share. Established semiconductor players strengthen strategies through mergers, acquisitions, and advanced fabrication capabilities. Smaller innovators contribute specialized technologies, while regional leaders drive expansion by leveraging localized R&D and strategic alliances across critical end-user industries.
Brand and Channel Strategies
Producers are strengthening brand presence through multi-channel strategies focused on direct enterprise sales, OEM integration, and cloud alliances. More than 40% of providers rely on partnerships with data center operators and electronics manufacturers. Digital platforms and performance-driven branding continue to support growth while building long-term client relationships in high-demand sectors.
Innovation Drivers and Technological Advancements
Over 50% of advancements are driven by memory architectures such as ReRAM, MRAM, and 3D XPoint. Innovation focuses on higher endurance, scalability, and power efficiency. Strong collaboration between semiconductor firms, research institutions, and cloud providers accelerates technological advancements, ensuring market expansion across computing, AI, and connected infrastructure applications.
Regional Momentum and Expansion
Asia-Pacific accounts for more than 45% of demand, driven by semiconductor manufacturing strength and consumer electronics. North America emphasizes enterprise adoption and AI-driven innovation, while Europe prioritizes regulatory-aligned strategies. Companies pursue regional expansion through new fabrication hubs, R&D centers, and technology alliances, ensuring long-term growth and resilience.
Future Outlook
The market’s future outlook emphasizes accelerated innovation, strategic collaboration, and adaptive strategies to meet evolving digital infrastructure needs. By 2030, more than 60% of providers are expected to integrate advanced non-volatile memory into AI, IoT, and next-gen computing systems. With strong focus on sustainable expansion, the sector is positioned for consistent growth.
Key players in Next Generation Non Volatile Memory Market include:
- Samsung Electronics
- SK Hynix
- Micron Technology
- Intel Corporation
- Western Digital (SanDisk)
- Kioxia Corporation (Toshiba Memory)
- GlobalFoundries
- Cypress Semiconductor (Infineon Technologies)
- Renesas Electronics Corporation
- Everspin Technologies
- Rambus Inc.
- Crossbar, Inc.
- Nantero, Inc.
- Weebit Nano
- IMEC
In this report, the profile of each market player provides following information:
- Company Overview and Product Portfolio
- Market Share Analysis
- Key Developments
- Financial Overview
- Strategies
- Company SWOT Analysis
- Introduction
- Research Objectives and Assumptions
- Research Methodology
- Abbreviations
- Market Definition & Study Scope
- Executive Summary
- Market Snapshot, By Memory Type
- Market Snapshot, By Wafer Size
- Market Snapshot, By Application
- Market Snapshot, By Region
- Next Generation Non Volatile Memory Market Dynamics
- Drivers, Restraints and Opportunities
- Drivers
-
Advancements in Quantum Computing
-
Shift Towards 5G Technology and Networks
-
Increased Demand for High-Performance Computing
-
Adoption of Memory Technologies in Aerospace and Defense
-
- Restraints
-
Power Consumption Concerns
-
Compatibility with Existing Systems
-
Limited Data Retention and Durability
-
Regulatory and Compliance Challenges
-
- Opportunities
-
Impact of Technological Alternatives
-
Market Awareness and Adoption Rate
-
Future Outlook and Potential Solutions
-
Supply Chain and Raw Material Availability
-
- Drivers
- PEST Analysis
- Political Analysis
- Economic Analysis
- Social Analysis
- Technological Analysis
- Porter's Analysis
- Bargaining Power of Suppliers
- Bargaining Power of Buyers
- Threat of Substitutes
- Threat of New Entrants
- Competitive Rivalry
- Drivers, Restraints and Opportunities
- Market Segmentation
- Next Generation Non Volatile Memory Market, By Memory Type, 2021 - 2031 (USD Million)
- Hybrid Memory Cube (HMC)
- High-Bandwidth Memory (HBM)
- Next Generation Non Volatile Memory Market, By Wafer Size, 2021 - 2031 (USD Million)
- 200 mm
- 300 mm
- Next Generation Non Volatile Memory Market, By Application, 2021 - 2031 (USD Million)
- BFSI
- Consumer Electronics
- Government
- Telecommunications
- Information Technology
- Others
- Next Generation Non Volatile Memory Market, By Geography, 2021 - 2031 (USD Million)
-
North America
-
United States
-
Canada
-
-
Europe
-
Germany
-
United Kingdom
-
France
-
Italy
-
Spain
-
Nordic
-
Benelux
-
Rest of Europe
-
-
Asia Pacific
-
Japan
-
China
-
India
-
Australia & New Zealand
-
South Korea
-
ASEAN (Association of South East Asian Countries)
-
Rest of Asia Pacific
-
-
Middle East & Africa
-
GCC
-
Israel
-
South Africa
-
Rest of Middle East & Africa
-
-
Latin America
-
Brazil
-
Mexico
-
Argentina
-
Rest of Latin America
-
-
- Next Generation Non Volatile Memory Market, By Memory Type, 2021 - 2031 (USD Million)
- Competitive Landscape
- Company Profiles
- li>Samsung Electronics
- SK Hynix
- Micron Technology
- Intel Corporation
- Western Digital (SanDisk)
- Kioxia Corporation (Toshiba Memory)
- GlobalFoundries
- Cypress Semiconductor (Infineon Technologies)
- Renesas Electronics Corporation
- Everspin Technologies
- Rambus Inc.
- Crossbar, Inc.
- Nantero, Inc.
- Weebit Nano
- IMEC
- Company Profiles
- Analyst Views
- Future Outlook of the Market