Molded Interconnect Devices (MID) Market

By Product Type;

Antennae & Connectivity Modules, Sensors, Connectors & Switches, Lighting, and Others

By Outlook;

Laser Direct Structuring (LDS) and Two-shot Molding

By Industry;

Telecommunications, Consumer Electronics, Automotive, Medica,l and Industrial

By Geography;

North America, Europe, Asia Pacific, Middle East & Africa, and Latin America - Report Timeline (2021 - 2031)
Report ID: Rn150398065 Published Date: June, 2025 Updated Date: August, 2025

Molded Interconnect Devices (MID) Market Overview

Molded Interconnect Devices (MID) Market (USD Million)

Molded Interconnect Devices (MID) Market was valued at USD 1,833.95 million in the year 2024. The size of this market is expected to increase to USD 4,532.97 million by the year 2031, while growing at a Compounded Annual Growth Rate (CAGR) of 13.8%.


Molded Interconnect Devices (MID) Market

*Market size in USD million

CAGR 13.8 %


Study Period2025 - 2031
Base Year2024
CAGR (%)13.8 %
Market Size (2024)USD 1,833.95 Million
Market Size (2031)USD 4,532.97 Million
Market ConcentrationLow
Report Pages377
1,833.95
2024
4,532.97
2031

Major Players

  • Molex
  • LPKF Laser & Electronics
  • TE Connectivity
  • HARTING
  • Arlington Plating Company
  • JOHNAN
  • MID Solutions
  • 2E Mechatronic
  • Multiple Dimensions

Market Concentration

Consolidated - Market dominated by 1 - 5 major players

Molded Interconnect Devices (MID) Market

Fragmented - Highly competitive market without dominant players


The Molded Interconnect Devices (MID) Market is experiencing robust growth as industries seek smarter integration of mechanical and electronic components. Roughly 62% of manufacturers now leverage MID technologies to streamline device architecture and reduce spatial requirements. This design shift is empowering advanced functionalities across electronic systems.

Material and Manufacturing Advancements
Breakthroughs in laser direct structuring (LDS) and high-performance thermoplastics are revolutionizing MID manufacturing. Nearly 48% of MID components now use LDS, benefiting from its precision and customizable circuit pathways. These advancements are making MID more scalable, durable, and cost-effective.

Rising Adoption in Automotive and Consumer Electronics
MID integration in automotive and consumer electronics is increasing due to its versatility and design efficiency. About 51% of automotive electronics, including sensors and infotainment modules, now rely on MID for better functionality. The demand for connected and intelligent systems continues to drive MID penetration.

Eco-Friendly and Cost-Effective Benefits Fuel Growth
MID solutions are gaining traction due to their environmentally friendly and cost-saving attributes. More than 57% of electronics manufacturers are shifting toward sustainable production, and MID offers an ideal fit by reducing waste and assembly complexity. This positions MID as a preferred solution for future-forward electronic design.

  1. Introduction
    1. Research Objectives and Assumptions
    2. Research Methodology
    3. Abbreviations
  2. Market Definition & Study Scope
  3. Executive Summary
    1. Market Snapshot, By Product Type
    2. Market Snapshot, By Outlook
    3. Market Snapshot, By Industry
    4. Market Snapshot, By Region
  4. Molded Interconnect Devices (MID) Market Dynamics
    1. Drivers, Restraints and Opportunities
      1. Drivers
        1. Miniaturization Demand
        2. IoT Expansion
        3. Automotive Integration
        4. Consumer Electronics Growth
      2. Restraints
        1. Complex Design Requirements
        2. Material Compatibility Issues
        3. High Initial Costs
        4. Limited Industry Standards
      3. Opportunities
        1. Medical Device Applications
        2. Smart Home Technologies
        3. Aerospace Innovations
        4. Sustainable Manufacturing
    2. PEST Analysis
      1. Political Analysis
      2. Economic Analysis
      3. Social Analysis
      4. Technological Analysis
    3. Porter's Analysis
      1. Bargaining Power of Suppliers
      2. Bargaining Power of Buyers
      3. Threat of Substitutes
      4. Threat of New Entrants
      5. Competitive Rivalry
  5. Market Segmentation
    1. Molded Interconnect Devices (MID) Market, By Product Type, 2021 - 2031 (USD Million)
      1. Antennae & Connectivity
      2. Modules
      3. Sensors
      4. Connectors & Switches
      5. Lighting
      6. Others
    2. Molded Interconnect Devices (MID) Market, By Outlook, 2021 - 2031 (USD Million)
      1. Laser Direct Structuring (LDS)
      2. Two-shot Molding
    3. Molded Interconnect Devices (MID) Market, By Industry, 2021 - 2031 (USD Million)
      1. Telecommunications
      2. Consumer Electronics
      3. Automotive
      4. Medical and Industrial
    4. Molded Interconnect Devices (MID) Market, By Geography, 2021 - 2031 (USD Million)
      1. North America
        1. United States
        2. Canada
      2. Europe
        1. Germany
        2. United Kingdom
        3. France
        4. Italy
        5. Spain
        6. Nordic
        7. Benelux
        8. Rest of Europe
      3. Asia Pacific
        1. Japan
        2. China
        3. India
        4. Australia & New Zealand
        5. South Korea
        6. ASEAN (Association of South East Asian Countries)
        7. Rest of Asia Pacific
      4. Middle East & Africa
        1. GCC
        2. Israel
        3. South Africa
        4. Rest of Middle East & Africa
      5. Latin America
        1. Brazil
        2. Mexico
        3. Argentina
        4. Rest of Latin America
  6. Competitive Landscape
    1. Company Profiles
      1. Molex
      2. LPKF Laser & Electronics
      3. TE Connectivity
      4. HARTING
      5. Arlington Plating Company
      6. JOHNAN
      7. MID Solutions
      8. 2E Mechatronic
      9. Multiple Dimensions
  7. Analyst Views
  8. Future Outlook of the Market