Electronic Circuit Board Level Underfill Material Market

• In December 2021, MacDermid Alpha showcased its ALPHA HiTech portfolio of underfill solutions at the IPC APEX EXPO in California, aiming to expand its presence in the electronic circuit board level underfill materials market​

• In 2022, India’s consumer electronics sector is expected to grow significantly, fueling the demand for electronic circuit board level underfill materials, with notable demand from smartphone and laptop sectors​

In this report, The Electronic Circuit Board Level Underfill Material Market has been segmented by Material, Product Type, Board Type, Packaging Type, Application Area and Geography.

Electronic Circuit Board Level Underfill Material Market, Segmentation by Material

The Electronic Circuit Board Level Underfill Material Market has been segmented by Material into Quartz/Silicone, Alumina Based, Epoxy Based, Urethane Based, Acrylic Based and Others.

Quartz/Silicone

Quartz/Silicone underfill materials account for nearly 25–27% of the market, widely used in thermal stability and stress resistance applications. Their ability to enhance reliability in advanced circuit boards makes them a preferred choice in high-performance electronics.

Alumina Based

Alumina-based materials represent about 15–17%, valued for their excellent thermal conductivity and mechanical strength. They are increasingly applied in power devices and high-frequency circuits to improve long-term durability.

Epoxy Based

Epoxy-based underfills hold close to 30–32%, making them the most widely used due to their strong adhesion, versatility, and cost-effectiveness. They dominate in consumer electronics and semiconductor packaging solutions.

Urethane Based

Urethane-based materials cover nearly 10–12% of the market, offering flexibility, moisture resistance, and strong mechanical properties. Their usage is rising in applications where stress absorption and long-term reliability are critical.

Acrylic Based

Acrylic-based underfills account for around 8–10%, recognized for their fast curing, low cost, and good surface adhesion. They are preferred for applications requiring quick assembly and cost efficiency.

Others

Other materials represent about 5–6%, including innovative hybrid formulations and specialty polymers. These are designed to meet niche requirements in next-generation electronics and customized engineering solutions.

Electronic Circuit Board Level Underfill Material Market, Segmentation by Product Type

The Electronic Circuit Board Level Underfill Material Market has been segmented by Product Type into Underfill and Gob Top Encapsulations.

Underfill

Underfill materials dominate the market with a share of nearly 65–68%, driven by their extensive use in semiconductor packaging and circuit board protection. These materials deliver enhanced structural strength, minimize risks from thermal expansion, and play a critical role in ensuring the longevity of advanced electronic devices.

Gob Top Encapsulations

Gob Top Encapsulations represent around 32–35% of the market, gaining traction in IC packaging and consumer electronic devices. Known for their superior moisture resistance and contaminant protection, these encapsulations improve durability, making them highly effective in compact and portable device applications.

Electronic Circuit Board Level Underfill Material Market, Segmentation by Board Type

The Electronic Circuit Board Level Underfill Material Market has been segmented by Board Type into CSP (Chip Scale Package, BGA (Ball Grid array) and Flip Chips.

CSP (Chip Scale Package)

CSP holds about 40–42% of the underfill material market, strongly driven by its use in smartphones, tablets, and portable electronics. The design enables miniaturization, provides excellent thermal efficiency, and supports the growing demand for compact high-performance devices.

BGA (Ball Grid Array)

BGA captures nearly 35–37% of the market, preferred in computing, automotive electronics, and communication systems. Known for superior heat dissipation and electrical performance, BGA packaging improves reliability and extends the lifespan of complex circuits.

Flip Chips

Flip Chips make up around 22–25%, gaining popularity in semiconductors, AI-driven processors, and data centers. With features like high I/O capability, enhanced signal integrity, and faster processing speeds, Flip Chips are pivotal in next-generation high-tech devices.

Electronic Circuit Board Level Underfill Material Market, Segmentation by Packaging Type

The Electronic Circuit Board Level Underfill Material Market has been segmented by Packaging Type into Chip-on-Board (COB)

Chip-on-Board (COB)

The Chip-on-Board (COB) segment dominates this category with close to 100% share, reflecting its critical role in electronics manufacturing. COB technology is favored for its compact design, improved thermal management, and enhanced electrical performance, making it indispensable in LED applications, consumer electronics, and circuit board assemblies. Its increasing adoption in energy-efficient lighting is expected to boost growth in the coming years.

Electronic Circuit Board Level Underfill Material Market, Segmentation by Application Area

The Electronic Circuit Board Level Underfill Material Market has been segmented by Application Area into Consumer Electronics, Aerospace and Defense

Consumer Electronics

The consumer electronics segment dominates the market with around 55–60% share, driven by the surge in smartphones, tablets, and wearables. The demand for miniaturized, durable, and heat-resistant circuits makes underfill materials essential in enhancing device performance and longevity.

Aerospace

The aerospace sector contributes approximately 20–22% of the market, with underfill materials ensuring reliability in extreme environments. They are widely used in avionics, sensors, and navigation systems, supporting the industry’s shift toward lightweight, high-performance electronics.

Defense

The defense segment accounts for nearly 18–20%, where underfill materials are vital for rugged electronic systems. Their ability to provide shock resistance and long-term stability makes them indispensable in advanced communication networks and surveillance equipment.

Electronic Circuit Board Level Underfill Material Market, Segmentation by Geography

In this report, The Electronic Circuit Board Level Underfill Material Market has been segmented by Geography into five regions; North America, Europe, Asia Pacific, Middle East & Africa and Latin America.

Global Electronic Circuit Board Level Underfill Material Market Share (%), by Geographical Region

North America

The North American market contributes nearly 28–30%, fueled by robust demand from semiconductor packaging and advanced electronics manufacturing. With strong investments in R&D and the presence of leading technology firms, the region remains a key growth driver.

Europe

Europe captures around 20–22% share, supported by the expansion of automotive electronics and industrial automation systems. Strict compliance with safety and quality standards continues to accelerate the use of advanced underfill materials.

Asia Pacific

The Asia Pacific region dominates globally with over 40–45% share, led by strong semiconductor and electronics production across China, Japan, South Korea, and Taiwan. Growing demand for consumer electronics and large-scale manufacturing capabilities position this region as the fastest-growing market.

Middle East & Africa

The Middle East & Africa market contributes about 5–6%, primarily driven by expanding telecommunications, increasing defense electronics adoption, and investments in smart infrastructure projects. These factors support steady regional growth.

Latin America

Latin America holds nearly 6–7%, with growth centered on Brazil and Mexico. The rising need for consumer and automotive electronics along with adoption in industrial applications enhances the market outlook in this region.

This report provides an in depth analysis of various factors that impact the dynamics of Global Electronic Circuit Board Level Underfill Material Market. These factors include; Market Drivers, Restraints and Opportunities Analysis.

Drivers, Restraints and Opportunity Analysis

Drivers :

• Miniaturization
• High-performance electronics

• Advanced packaging - Advanced packaging refers to the sophisticated methods and technologies used to assemble semiconductor devices and integrate multiple components into a single package. This approach goes beyond traditional packaging techniques to enhance performance, reduce size, and improve functionality. Advanced packaging is driven by the demand for smaller, more powerful, and energy-efficient electronic devices, as well as the need for improved thermal and electrical management.

  One of the key aspects of advanced packaging is the integration of multiple dies or chips into a single package. Techniques such as System-in-Package (SiP) and Multi-Chip Modules (MCM) allow for the combination of different functionalities—such as processing, memory, and sensors—into one compact module. This integration not only saves space but also reduces the distance between components, leading to faster data transfer and improved overall performance.

  Another important advancement is the use of 3D packaging technologies, which stack multiple layers of semiconductor devices vertically. Through processes like wafer-level stacking and chip-on-wafer bonding, 3D packaging enables higher density and more efficient use of space. This technique helps to overcome the limitations of traditional planar packaging and allows for more compact and powerful devices.

  Advanced packaging also includes enhancements in thermal and mechanical management. Techniques such as advanced heat spreaders, thermal interface materials, and improved underfill materials are used to manage the heat generated by high-performance components. Effective thermal management is crucial for maintaining device reliability and performance, especially as components become more powerful and generate more heat.

Restraints :

• High costs
• Complex application processes

• Limited availability of raw materials -The limited availability of raw materials poses a significant challenge in the electronic circuit board level underfill material market and the broader electronics industry. This constraint impacts several aspects of manufacturing and product development.

  Raw materials for underfill materials, such as high-purity resins, fillers, and specific additives, are essential for producing high-quality, reliable products. Shortages or restricted access to these materials can lead to delays in production, increased costs, and potential compromises in product performance. For instance, key components like silica for quartz-based underfills or specific types of resins used in epoxy-based materials may experience supply issues, affecting the availability and pricing of underfill materials.

  Additionally, the dependence on specific raw materials can lead to supply chain vulnerabilities. Disruptions in the supply of these materials, whether due to geopolitical issues, natural disasters, or trade restrictions, can significantly impact manufacturing schedules and increase production costs. Companies may face challenges in sourcing alternative materials or suppliers, which can further exacerbate delays and cost increases.

  The limited availability of raw materials also drives the need for research and innovation in the development of alternative materials or more sustainable sources. Manufacturers and researchers are increasingly focused on finding substitutes that can offer similar performance characteristics while alleviating supply constraints. This focus on innovation aims to enhance material resilience and reduce dependency on scarce resources.

Opportunities :

• Growth in IoT applications
• Expansion in wearable technology

• Advancements in automotive electronics - Advancements in automotive electronics are revolutionizing the automotive industry by enhancing vehicle safety, performance, and connectivity. These advancements span several key areas, each contributing to the development of more sophisticated and efficient vehicles.

  One significant advancement is the integration of advanced driver-assistance systems (ADAS). ADAS includes technologies such as adaptive cruise control, lane-keeping assist, automatic emergency braking, and parking assistance. These systems rely on a combination of sensors, cameras, radar, and lidar to provide real-time data and improve driving safety. By aiding in navigation and hazard detection, ADAS enhances the overall driving experience and supports the development of autonomous driving capabilities.

  Another critical area of advancement is the growth of electric vehicles (EVs). Automotive electronics play a crucial role in EVs, including battery management systems (BMS), electric motor control, and charging infrastructure. Innovations in these areas are improving battery efficiency, extending driving range, and enhancing the overall performance of electric vehicles. Smart charging solutions and energy management systems are also evolving to optimize energy use and support the transition to sustainable transportation.

  Infotainment systems are also undergoing significant advancements. Modern vehicles are equipped with advanced infotainment systems that integrate with smartphones, provide real-time navigation, and support voice recognition. These systems enhance driver and passenger comfort by offering seamless connectivity, entertainment options, and personalized user experiences. Integration with cloud services and over-the-air (OTA) updates allows for continuous improvement and customization of infotainment features.

Key players in Global Electronic Circuit Board Level Underfill Material Market include :

• B. Fuller Company
• VINCAE Advanced Materials, LLC
• Henkel

In this report, the profile of each market player provides following information:

• Company Overview and Product Portfolio
• Key Developments
• Financial Overview
• Strategies
• Company SWOT Analysis