• In May 2024, H.B. Fuller acquired ND Industries, including the Vibra‑Tite® adhesive‑coated fastener line, integrating five US facilities and 300 staff to boost its engineering adhesives capabilities across automotive, aerospace, and electronics.

• In May 2023, Arkema bolstered Bostik by acquiring German company Polytec PT, enhancing its foothold in thermal interface materials and high‑performance adhesives tailored for electronics and battery markets.

In this report, the Electronic Adhesives Market has been segmented by Form, Resin Type, Type, Application and Geography.

Electronic Adhesives Market, Segmentation by Form

The Electronic Adhesives Market has been segmented by Form into Liquid Form, Paste Form and Solid Form.

Liquid Form

Liquid electronic adhesives are widely used for their versatility, ease of application, and compatibility with automated dispensing systems. They are commonly employed in underfill encapsulation, potting, and conformal coating applications. This form dominates the market with an estimated share of around 50%, driven by high demand in consumer electronics and automated assembly lines.

Paste Form

Paste form adhesives offer high bond strength and are ideal for surface mount technology (SMT), die attach applications, and thermal management solutions. These adhesives provide excellent electrical conductivity and are preferred in power devices and LED packaging. This segment holds about 35% of the market, supported by growing demand in semiconductors and advanced circuit assemblies.

Solid Form

Solid form electronic adhesives, including films and preforms, are used in applications requiring precision bonding and low mess processing. They offer consistent thickness and are ideal for multilayer assemblies and flexible electronics. Although less prevalent, this segment contributes around 15% of the market and is gaining traction in miniaturized electronic devices.

Electronic Adhesives Market, Segmentation by Resin Type

The Electronic Adhesives Market has been segmented by Resin Type into Epoxy, Silicone, Acrylics, Polyurethane, and Others.

Epoxy

Epoxy adhesives dominate the electronic adhesives market due to their superior thermal stability, mechanical strength, and electrical insulation. They are widely used in semiconductors, LEDs, and PCB assemblies. With strong adhesion to various substrates, epoxy-based adhesives account for approximately 45% of the market, favored for rigid bonding applications.

Silicone

Silicone adhesives are valued for their flexibility, moisture resistance, and excellent thermal conductivity, making them ideal for thermal interface materials and electronic encapsulation. They perform reliably across a wide temperature range. This segment holds around 25% of the market, particularly strong in automotive electronics and consumer devices.

Acrylics

Acrylic adhesives are known for their fast curing, UV resistance, and good electrical properties. They are commonly used in flexible circuit bonding and display components. This resin type contributes about 15% of the market and is growing in demand for low-to-medium strength bonding applications.

Polyurethane

Polyurethane adhesives offer excellent impact resistance and mechanical flexibility, making them suitable for wearable electronics and shock-sensitive components. They provide strong bonding on plastics and composites. This segment accounts for nearly 10% of the market and is expanding with the rise of flexible electronic applications.

Others

The Others category includes hybrid resins and custom formulations used in niche applications like bioelectronics, photovoltaic systems, and microelectromechanical systems (MEMS). Though smaller in share at about 5%, this segment is expected to grow with increased focus on specialized electronic adhesive solutions.

Electronic Adhesives Market, Segmentation by Type

The Electronic Adhesives Market has been segmented by Type into Electrically Conductive, Thermally Conductive, UV Curing, and Others.

Electrically Conductive

Electrically conductive adhesives are critical in applications where electrical continuity is required, such as in semiconductor packaging, LED assembly, and touch panels. These adhesives often contain silver or carbon fillers to enable conductivity. This type dominates the market with a share of approximately 40%, driven by demand in miniaturized electronic components and EMI shielding applications.

Thermally Conductive

Thermally conductive adhesives are widely used for heat dissipation in power devices, LEDs, and IC packaging. These adhesives ensure thermal interface efficiency while maintaining mechanical bonding. This segment holds about 30% of the market, supported by the growing need for thermal management in high-performance electronics.

UV Curing

UV curing adhesives offer fast curing times and are ideal for automated production lines in display manufacturing, smartphones, and optical bonding applications. They provide excellent clarity and adhesion to glass and plastics. This type accounts for approximately 20% of the market and is expanding with the demand for precision electronic assembly.

Others

The Others category includes pressure-sensitive adhesives, hot melt adhesives, and anisotropic conductive adhesives, used in specialized electronics like flexible circuits, MEMS, and wearable devices. This segment holds around 10% of the market and is expected to grow with next-gen electronic designs.

Electronic Adhesives Market, Segmentation by Application

The Electronic Adhesives Market has been segmented by Application into Conformal Coatings, Surface Mounting, Encapsulation, Wire Tacking, and Others.

Conformal Coatings

Conformal coatings are applied to protect electronic components from moisture, dust, chemicals, and temperature extremes. Electronic adhesives used in this application ensure uniform protective layers over printed circuit boards (PCBs). This segment leads the market with a share of approximately 35%, driven by its critical role in automotive electronics, consumer devices, and aerospace systems.

Surface Mounting

Surface mounting applications utilize adhesives to secure surface-mounted devices (SMDs) during reflow soldering. These adhesives provide precise placement stability and are widely used in high-speed automated assembly. This segment holds around 25% of the market, supported by the increasing production of compact and densely packed PCBs.

Encapsulation

Encapsulation adhesives are used to protect sensitive electronic components from mechanical stress, corrosion, and electrical interference. They are common in LEDs, ICs, and power modules. This segment accounts for approximately 20% of the market, favored for enhancing component durability and thermal management.

Wire Tacking

Wire tacking adhesives are applied to secure wiring and bonded components in place during manufacturing or repair. They provide vibration resistance and prevent mechanical damage in automotive and consumer electronics. This segment contributes about 10% of the market and is gaining attention in high-mobility applications.

Others

The Others category includes applications such as potting, thermal interface bonding, and display assembly. These adhesives serve in specialized use-cases like flexible electronics and wearables. This segment represents around 10% of the market and is expected to grow with innovations in smart device assembly.

Electronic Adhesives Market, Segmentation by Geography

In this report, the Electronic Adhesives Market has been segmented by Geography into five regions; North America, Europe, Asia Pacific, Middle East and Africa and Latin America.

Electronic Adhesives Market Share (%), by Geographical Region

North America

North America holds a significant share in the electronic adhesives market, driven by the presence of established electronics manufacturing, aerospace industries, and a robust automotive electronics sector. The U.S. leads the region with growing adoption of adhesives in semiconductor packaging and LED assembly. The region accounts for approximately 25% of the global market.

Europe

Europe is a key market supported by demand from automotive electronics, consumer devices, and industrial automation systems. Countries such as Germany, France, and the UK are major contributors, with a focus on environmentally compliant formulations and advanced assembly technologies. Europe holds about 22% of the global market share.

Asia Pacific

Asia Pacific dominates the electronic adhesives market, contributing the largest share of approximately 40%. The region benefits from high-volume electronics production in China, Japan, South Korea, and Taiwan, coupled with the strong presence of OEMs and contract manufacturers. Growth is further fueled by the expanding semiconductor and display panel industries.

Middle East and Africa

The Middle East and Africa region is an emerging market, with growing investments in telecommunications infrastructure, consumer electronics, and automotive systems. While still developing, this region accounts for approximately 6% of the market and is expected to grow with digital transformation initiatives across key economies.

Latin America

Latin America is gradually expanding its role in the electronic adhesives market, particularly in automotive electronics, LED lighting, and household appliances. Brazil and Mexico are the primary contributors, with ongoing investments in electronics assembly operations. The region holds about 7% of the global market.

This report provides an in depth analysis of various factors that impact the dynamics of Electronic Adhesives Market. These factors include; Market Drivers, Restraints and Opportunities Analysis.

Drivers, Restraints and Opportunity Analysis

Drivers

• Rising Electronics Demand
• Technological Advancements
• Increasing Smartphone Production

• Growth in Automotive Electronics - The relentless growth of automotive electronics is transforming vehicles into high-performance computers on wheels. revenue from these sophisticated systems crossed USD 293 billion in 2024, and every additional control unit, sensor or infotainment module needs an equally advanced adhesive to secure it safely and dissipate heat reliably. As automakers race to pack more processing power and connectivity into tighter spaces, demand surges for electronic adhesives that cure fast, conduct heat, and resist vibration.

  Electrification magnifies this trend. Battery packs, power inverters and on-board chargers generate significant thermal loads while facing constant shock on the road. High-performance epoxies and silicone-based adhesives provide the thermal interface and structural bonding required, pushing the dedicated automotive-electronics-adhesives segment toward USD 11.7 billion by 2030 at a solid 7.5 % CAGR.

  Meanwhile, the rollout of advanced driver-assistance systems (ADAS) and sensor-rich autonomous platforms calls for ultra-precise, low-outgassing adhesives that keep cameras, LiDARs and radars perfectly aligned despite temperature swings from –40 °C to +150 °C. Fail-safe bonding is critical because even micro-shifts could distort safety-critical data. Tier-1 suppliers therefore specify specialty conductive and semi-structural formulas that maintain alignment, damp vibrations and shield circuits from electromagnetic interference.

  Finally, the auto industry’s drive toward lightweighting and miniaturization means adhesive technologies increasingly replace mechanical fasteners, shave grams from module housings and open design freedom for thinner electronics. As a result, the wider electronic adhesives market is forecast to climb from about USD 6.1 billion in 2025 to USD 13.7 billion by 2035, with automotive applications among the most dynamic contributors. :contentReference[oaicite:3]{index=3}

Restraints

• Stringent Regulatory Requirements
• Intense Market Competition

• Limited Availability of Skilled Labor - The limited availability of skilled labor is emerging as a critical brake on the electronic adhesives market. Industry surveys show that more than three-quarters of electronics manufacturers struggle to fill technician and process-engineering roles, forcing production lines to run below capacity and delaying new product launches.

  Applying modern epoxy, silicone and polyurethane adhesives is no longer a simple manual task—it involves precision mixing, controlled dispensing, real-time thermal profiling and meticulous quality checks. Without enough trained operators and maintenance experts to calibrate jet-dispensing robots or interpret cure-cycle data, producers face higher defect rates and costly rework, prompting some to stick with older, lower-performance bonding methods simply because they are easier to run.

  The shortage also tightens budgets. Wages for experienced adhesive specialists and electronics assemblers have risen sharply, adding to overall manufacturing costs and squeezing margins on already competitive consumer-electronics contracts. In turn, this discourages smaller EMS providers from investing in the latest conductive or thermally conductive materials even when those products would improve long-term reliability.

  Finally, fast-growing hubs such as India, Vietnam and Mexico face an even steeper learning curve: factories are scaling up for smartphones, EV batteries and IoT devices just as seasoned engineers retire in record numbers. Unless major upskilling programs, automation initiatives and university partnerships accelerate, the labor bottleneck will continue to restrain market expansion despite otherwise robust end-use demand.

Opportunities

• Innovations in Adhesive Technologies
• Growth in IoT Devices

• Development of Eco-friendly Solutions - Rising pressure from regulators, investors, and consumers is turning eco-friendly electronic adhesives from a niche option into a mainstream growth engine. Market analysts expect the wider sustainable-adhesives segment to expand from roughly USD 2.9 billion in 2024 to USD 3.7 billion by 2029, while related adhesive-tape lines are tracking a healthy 7.5 % CAGR through 2030 as brands race to lower product carbon footprints.

  In parallel, a new class of zero-carbon and bio-based epoxies, polyurethanes, and water-borne systems is winning OEM validation. Reports peg the zero-carbon-adhesives market at about USD 2.5 billion in 2025 with a projected 12 % CAGR to 2033, driven by plant-oil feedstocks, starch-derived polymers, and manufacturing routes that integrate renewable energy and carbon-capture steps. Such materials promise comparable bond strength and thermal reliability without the petrochemical footprint, positioning suppliers for premium pricing and long-term contracts.

  Tighter global rules amplify this opportunity. Directives like RoHS, REACH, and impending halogen bans are forcing electronics assemblers to phase out lead, tin, and brominated flame retardants. Makers such as ThreeBond now offer halogen-free, solvent-free, UL V-0-rated adhesives that satisfy these mandates, eliminating costly compliance audits for downstream customers. Companies able to deliver documented “green” formulations gain fast-track approvals and preferred-supplier status in automotive, smartphone, and medical-device supply chains.

  Crucially, sustainability no longer requires sacrificing performance. Recent launches include a halogen-free UV-curable epoxy that survives 1,000 h of 85 °C/85 % RH, cures in seconds, and maintains camera-module alignment from –55 °C to 200 °C. Likewise, Master Bond’s solvent-free LED-curable lines cut energy use while offering RoHS compliance and recyclable packaging. These advances prove that greener chemistries can meet—or exceed—legacy benchmarks for thermal cycling, vibration resistance, and miniaturization, encouraging broader industry adoption.

  Geographically, Asia-Pacific is emerging as the springboard for eco-friendly electronic adhesives. Governments in China, Japan, and India are pairing stricter VOC limits with R&D incentives, prompting local formulators and majors alike to open dedicated green-chemistry hubs. With electronics production shifting to these regions and the overall electronics-adhesives market itself forecast to reach USD 13.7 billion by 2035, suppliers who master sustainable solutions now stand to secure multi-year volume deals and capture outsized share in the next wave of device launches.

Key players in Electronic Adhesives Market include:

• Henkel AG & Co. KGaA
• Dow Inc
• 3M Company
• H.B. Fuller Company
• Lord Corporation
• Master Bond Inc
• Dexerials Corporation
• Samsung Cheil Industries Inc
• Nordson Corporation
• Shin-Etsu Chemical Co., Ltd

In this report, the profile of each market player provides following information:

• Company Overview and Product Portfolio
• Market Share Analysis
• Key Developments
• Financial Overview
• Strategies
• Company SWOT Analysis