Chemical Mechanical Planarization (CMP) Equipment Market
By Product Type;
CMP Equipment and CMP ConsumablesBy Technology;
Conventional CMP and Advanced CMPBy Wafer Size;
300mm, 200mm, and 150mmBy End-User;
Pureplay Foundries and IDMsBy Geography;
North America, Europe, Asia Pacific, Middle East & Africa, and Latin America - Report Timeline (2021 - 2031)CMP Equipment Market Overview
CMP Equipment Market (USD Million)
CMP Equipment Market was valued at USD 2,510.61 million in the year 2024. The size of this market is expected to increase to USD 3,676.43 million by the year 2031, while growing at a Compounded Annual Growth Rate (CAGR) of 5.6%.
Chemical Mechanical Planarization (CMP) Equipment Market
*Market size in USD million
CAGR 5.6 %
Study Period | 2025 - 2031 |
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Base Year | 2024 |
CAGR (%) | 5.6 % |
Market Size (2024) | USD 2,510.61 Million |
Market Size (2031) | USD 3,676.43 Million |
Market Concentration | Medium |
Report Pages | 322 |
Major Players
- Applied Materials Inc.
- Entegris Inc.
- Ebara Corporation
- Lapmaster Wolters Gmbh
- Dupont De Nemours Inc.
- Fujimi Incorporated
- Revasum Inc.
- Resonac Holdings Corporation (Showa Denko Materials)
- Okamoto Corporation
- Fujifilm Corporation (Fujifilm Holdings Corporation)
- Tokyo Seimitsu Co. Ltd (Accretech Create Corp.)
Market Concentration
Consolidated - Market dominated by 1 - 5 major players
Chemical Mechanical Planarization (CMP) Equipment Market
Fragmented - Highly competitive market without dominant players
The CMP Equipment Market is being reshaped by intelligent polishing solutions featuring pressure profiling, quality analytics, and automated problem detection. More than 50% of recent machines now offer precision slurry delivery and in-line quality checks. These technological advancements present strong opportunities to boost wafer yield, reduce downtime, and enable advanced device geometries.
Collaborative Developments Empower Fabrication Efficiency
Strong partnerships with slurry providers, CMP pads suppliers, and fab automation firms are creating more robust process platforms. Nearly 45% of emerging systems are co-developed among these groups, enhancing consistency, reducing variation, and shortening recipe development. These strategies lead to improved manufacturability and time-to-production benefits.
Growth Opportunities and Anticipated Future Trend
Rising focus on 3D integration, UDLM, and sub-7nm process nodes is generating wide opportunities. About 55% of equipment now includes adaptive polishing cycles, surface uniformity optimization, and real-time end-point sensing. The future outlook suggests continued momentum as fabs adopt increasingly intelligent and efficient CMP tools.
Innovation-Focused Strategies Driving Market Expansion
Equipment providers are prioritizing strategies such as remote monitoring, slurry recycling protocols, and energy-efficient drives. Over 60% of current systems offer telemetry integration, fault detection, and adaptive control loops. These innovations are powering consistent growth and contributing to expansion into advanced semiconductor applications like power devices and MEMS.
CMP Equipment Market Recent Developments
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In June 2021, Applied Materials unveiled new CMP technology tailored for cutting-edge wafer processing. The innovation was intended to address the industry's challenges in developing smaller, more intricate chip designs.
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In December 2022, Lam Research launched its new advanced CMP (Chemical Mechanical Planarization) technology aimed at increasing efficiency for next-gen semiconductor applications. This equipment supports the trend toward smaller, more powerful devices.
CMP Equipment Market Segment Analysis
In this report, the CMP Equipment Market has been segmented by Product Type, Technology, Wafer Size, End-User and Geography.
CMP Equipment Market, Segmentation by Product Type
The CMP Equipment Market has been segmented by Product Type into CMP Equipment and CMP Consumables.
CMP Equipment
The CMP Equipment segment accounts for a significant portion of the market, driven by its role in the planarization of semiconductor wafers. These systems are vital for achieving uniform wafer surfaces required in advanced chip manufacturing. Roughly 55% of the total market share is held by this sub-segment, reflecting strong demand for automated and high-precision equipment. The rise in technology node scaling continues to fuel its growth trajectory.
CMP Consumables
The CMP Consumables segment plays a crucial supporting role, contributing approximately 45% to the market. This includes slurries, pads, and conditioners used in the polishing process, which are essential for maintaining consistency and yield. Growth in this segment is driven by increased wafer production and the demand for high-performance, low-defect consumables. Continuous improvements in material science are enhancing the efficiency and lifespan of these products.
CMP Equipment Market, Segmentation by Technology
The CMP Equipment Market has been segmented by Technology into Conventional CMP and Advanced CMP.
Conventional CMP
The Conventional CMP segment continues to play a foundational role in semiconductor manufacturing, especially for mature nodes and legacy devices. It remains relevant for processes where cost-efficiency and reliability are prioritized. This segment accounts for approximately 40% of the total CMP technology market, driven by steady demand from industries using 200mm and 300mm wafers. Despite slower innovation, its importance persists due to high-volume production needs.
Advanced CMP
The Advanced CMP segment leads the market with nearly 60% share, propelled by its application in cutting-edge nodes and 3D integration technologies. It supports the fabrication of FinFETs, gate-all-around (GAA) FETs, and other next-gen architectures. With growing adoption in sub-10nm and EUV lithography processes, this segment is witnessing rapid advancements in precision, material selectivity, and defect reduction. Its growth aligns with rising demand for AI, HPC, and mobile devices.
CMP Equipment Market, Segmentation by Wafer Size
The CMP Equipment Market has been segmented by Wafer Size into 300mm, 200mm and 150mm.
300mm
The 300mm wafer segment dominates the CMP equipment market, contributing over 65% of the total share. This dominance is fueled by its widespread use in advanced semiconductor nodes and high-volume manufacturing. The segment is driven by demand from leading-edge fabs producing sub-10nm chips for AI, data centers, and consumer electronics. Ongoing investments in 300mm wafer fabs continue to strengthen its position.
200mm
The 200mm wafer segment holds around 25% of the CMP equipment market, mainly serving automotive, IoT, and industrial applications. It remains an essential size for fabricating legacy and analog devices where cost-efficiency is key. Many foundries continue to invest in 200mm line upgrades to extend the life of this technology node and meet niche market demands.
150mm
The 150mm wafer segment, though smaller, still contributes about 10% to the CMP equipment market. It primarily supports specialty applications and R&D environments. Demand persists in regions with low-volume production needs and for technologies like MEMS, sensors, and power devices. Its usage is expected to remain stable in select verticals.
CMP Equipment Market, Segmentation by End-User
The CMP Equipment Market has been segmented by End-User into Pureplay Foundries and IDMs.
Pureplay Foundries
Pureplay Foundries make up approximately 58% of the CMP equipment market, leading adoption due to their focus on advanced logic manufacturing. These foundries invest heavily in cutting-edge process nodes and are key enablers for fabless semiconductor companies. Growth in this segment is supported by increasing demand for AI, 5G, and high-performance computing chips, which require complex CMP processes.
IDMs
Integrated Device Manufacturers (IDMs) account for around 42% of the CMP equipment market. They maintain in-house fabrication and typically adopt CMP tools for both logic and memory devices. IDMs benefit from end-to-end process control and continue to invest in CMP solutions for technology scaling and vertical integration. Demand from sectors like automotive, data storage, and consumer electronics fuels steady growth in this segment.
CMP Equipment Market, Segmentation by Geography
In this report, the CMP Equipment Market has been segmented by Geography into five regions; North America, Europe, Asia Pacific, Middle East and Africa and Latin America.
Regions and Countries Analyzed in this Report
CMP Equipment Market Share (%), by Geographical Region
North America
North America holds around 22% of the CMP equipment market, driven by strong investments in semiconductor R&D and presence of major chip manufacturers. The U.S. leads the region with initiatives focused on domestic chip production and supply chain security. Growth is supported by increasing demand in AI, defense, and cloud computing sectors.
Europe
Europe contributes nearly 15% to the market, fueled by efforts to strengthen its position in the global semiconductor supply chain. The region is investing in advanced manufacturing capabilities and expanding R&D infrastructure. Demand is growing in segments such as automotive electronics, industrial automation, and energy-efficient chips.
Asia Pacific
Asia Pacific dominates the CMP equipment market with over 50% share, led by countries like China, Taiwan, South Korea, and Japan. This region is home to the world's largest foundries and IDMs, which invest heavily in cutting-edge wafer fabs. Rapid advancements in technology nodes and high-volume chip production continue to drive its leadership.
Middle East and Africa
The Middle East and Africa hold a smaller yet emerging share of about 5%. Growth is driven by national strategies to diversify economies and invest in high-tech industries. The focus is on building semiconductor capabilities and attracting foreign direct investment for future development.
Latin America
Latin America represents close to 8% of the CMP equipment market, supported by a growing interest in regional manufacturing hubs and electronics assembly. Countries like Brazil and Mexico are fostering partnerships to enhance semiconductor supply chains and reduce dependency on imports.
Market Trends
This report provides an in depth analysis of various factors that impact the dynamics of CMP Equipment Market. These factors include; Market Drivers, Restraints and Opportunities Analysis.
Comprehensive Market Impact Matrix
This matrix outlines how core market forces—Drivers, Restraints, and Opportunities—affect key business dimensions including Growth, Competition, Customer Behavior, Regulation, and Innovation.
Market Forces ↓ / Impact Areas → | Market Growth Rate | Competitive Landscape | Customer Behavior | Regulatory Influence | Innovation Potential |
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Drivers | High impact (e.g., tech adoption, rising demand) | Encourages new entrants and fosters expansion | Increases usage and enhances demand elasticity | Often aligns with progressive policy trends | Fuels R&D initiatives and product development |
Restraints | Slows growth (e.g., high costs, supply chain issues) | Raises entry barriers and may drive market consolidation | Deters consumption due to friction or low awareness | Introduces compliance hurdles and regulatory risks | Limits innovation appetite and risk tolerance |
Opportunities | Unlocks new segments or untapped geographies | Creates white space for innovation and M&A | Opens new use cases and shifts consumer preferences | Policy shifts may offer strategic advantages | Sparks disruptive innovation and strategic alliances |
Drivers, Restraints and Opportunity Analysis
Drivers
- Technological Advancements in CMP Processes
- Increasing Semiconductor Wafer Sizes
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Growing Demand for Consumer Electronics - The increasing consumption of consumer electronics such as smartphones, tablets, wearables, and smart home devices is significantly fueling the demand for CMP (Chemical Mechanical Planarization) equipment. These devices require high-performance semiconductors that support miniaturization, faster speeds, and energy efficiency—needs that CMP helps fulfill through precise wafer surface planarization. With electronics becoming more integrated into daily life, the demand for high-quality chips continues to rise.
Semiconductor manufacturers are expanding their production capabilities to meet this growing demand. As a result, the need for advanced CMP tools capable of producing sub-10nm and smaller nodes is more pressing than ever. The importance of flatness and accuracy in multilayer circuits makes CMP equipment indispensable in modern chip fabrication processes.
Innovations in electronics design—such as foldable displays, 5G-enabled devices, and high-resolution sensors—require advanced materials and processing techniques. CMP plays a critical role in enabling these innovations by providing uniform wafer surfaces, ensuring high yield and device reliability. As consumers demand sleeker and more capable devices, the CMP market benefits directly.
The global proliferation of Internet of Things (IoT) devices is further amplifying the demand for compact and complex integrated circuits. CMP equipment ensures the precision necessary for such advanced architectures, making it a pivotal component in the electronics manufacturing value chain.
Restraints
- Environmental and Safety Concerns
- Cyclic Nature of Semiconductor Industry
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Challenges in CMP for New Materials - One of the primary restraints for the CMP equipment market is the complexity in handling new materials used in advanced semiconductor devices. As chipmakers shift towards materials like cobalt, ruthenium, and low-k dielectrics, traditional CMP processes often fall short in achieving the desired results. These newer materials pose challenges in terms of removal rates, selectivity, and surface defect control.
The development of optimized slurries and pads that are compatible with these materials involves substantial time and R&D investment. This slows down production cycles and increases the cost for manufacturers, thereby affecting the overall market growth. Ensuring minimal material erosion while maintaining uniform planarization is a major technical hurdle.
The CMP process must be tightly integrated with metrology tools to monitor outcomes at nanoscale precision, especially when working with novel materials. This requires the procurement of highly specialized equipment and training, which can significantly raise operational costs for semiconductor fabs. Such barriers delay broader adoption of advanced CMP systems.
Another concern is the risk of cross-contamination during CMP when multiple materials are involved. Without precise control, residues and particle generation can compromise wafer integrity. As the industry moves toward complex device architectures like 3D NAND and FinFET, these limitations become more pronounced, creating headwinds for market expansion.
Opportunities
- Rapid Technological Innovations
- Increasing Focus on Green CMP Solutions
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Expansion of Semiconductor Foundries - The rapid expansion of semiconductor foundries worldwide is creating significant growth opportunities for the CMP equipment market. With increasing demand for chips across automotive, aerospace, medical, and consumer applications, foundries are investing in new fabs and upgrading existing facilities. This expansion drives the need for state-of-the-art CMP tools that can support high-volume, advanced-node manufacturing.
Emerging markets, particularly in Asia-Pacific, are witnessing strong governmental support to build domestic semiconductor ecosystems. Countries like China, India, and Vietnam are investing in semiconductor R&D and infrastructure, encouraging the setup of new foundry operations. CMP equipment providers stand to gain as they become essential partners in these manufacturing ecosystems.
As foundries move toward gate-all-around (GAA) transistors and heterogeneous integration, the CMP process becomes even more critical. Equipment that offers precise topography control and lower defect rates will be highly sought after. This presents opportunities for innovation in CMP system design, particularly in automation and AI-integrated process control.
The shift toward smart factories and Industry 4.0 practices also supports CMP market growth. Advanced foundries are adopting predictive maintenance and real-time analytics in CMP operations, increasing efficiency and lowering costs. Vendors that align with these digitalization trends are likely to see higher adoption of their CMP equipment solutions globally.
Competitive Landscape Analysis
Key players in CMP Equipment Market include:
- Applied Materials Inc.
- Entegris Inc.
- Ebara Corporation
- Lapmaster Wolters Gmbh
- Dupont De Nemours Inc.
- Fujimi Incorporated
- Revasum Inc.
- Resonac Holdings Corporation (Showa Denko Materials)
- Okamoto Corporation
- Fujifilm Corporation (Fujifilm Holdings Corporation)
- Tokyo Seimitsu Co. Ltd (Accretech Create Corp.)
In this report, the profile of each market player provides following information:
- Company Overview and Product Portfolio
- Market Share Analysis
- Key Developments
- Financial Overview
- Strategies
- Company SWOT Analysis
- Introduction
- Research Objectives and Assumptions
- Research Methodology
- Abbreviations
- Market Definition & Study Scope
- Executive Summary
- Market Snapshot, By Product Type
- Market Snapshot, By Technology
- Market Snapshot, By Wafer Size
- Market Snapshot, By End-User
- Market Snapshot, By Region
- CMP Equipment Market Dynamics
- Drivers, Restraints and Opportunities
- Drivers
- Technological Advancements in CMP Processes
- Increasing Semiconductor Wafer Sizes
- Growing Demand for Consumer Electronics
- Restraints
- Environmental and Safety Concerns
- Cyclic Nature of Semiconductor Industry
- Challenges in CMP for New Materials
- Opportunities
- Rapid Technological Innovations
- Increasing Focus on Green CMP Solutions
- Expansion of Semiconductor Foundries
- Drivers
- PEST Analysis
- Political Analysis
- Economic Analysis
- Social Analysis
- Technological Analysis
- Porter's Analysis
- Bargaining Power of Suppliers
- Bargaining Power of Buyers
- Threat of Substitutes
- Threat of New Entrants
- Competitive Rivalry
- Drivers, Restraints and Opportunities
- Market Segmentation
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CMP Equipment Market, By Product Type, 2021- 2031(USD Million)
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CMP Equipment
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CMP Consumables
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CMP Equipment Market, By Technology, 2021- 2031(USD Million)
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Conventional CMP
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Advanced CMP
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- CMP Equipment Market, By Wafer Size, 2021- 2031(USD Million)
- 300mm
- 200mm
- 150mm
- CMP Equipment Market, By End-User, 2021- 2031(USD Million)
- Pureplay Foundries
- IDMs
- CMP Equipment Market, By Geography, 2021- 2031(USD Million)
- North America
- United States
- Canada
- Europe
- Germany
- United Kingdom
- France
- Italy
- Spain
- Nordic
- Benelux
- Rest of Europe
- Asia Pacific
- Japan
- China
- India
- Australia & New Zealand
- South Korea
- ASEAN (Association of South East Asian Countries)
- Rest of Asia Pacific
- Middle East & Africa
- GCC
- Israel
- South Africa
- Rest of Middle East & Africa
- Latin America
- Brazil
- Mexico
- Argentina
- Rest of Latin America
- North America
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- Competitive Landscape
- Company Profiles
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Applied Materials Inc.
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Entegris Inc.
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Ebara Corporation
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Lapmaster Wolters Gmbh
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Dupont De Nemours Inc.
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Fujimi Incorporated
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Revasum Inc.
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Resonac Holdings Corporation (Showa Denko Materials)
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Okamoto Corporation
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Fujifilm Corporation (Fujifilm Holdings Corporation)
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Tokyo Seimitsu Co. Ltd (Accretech Create Corp.)
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- Company Profiles
- Analyst Views
- Future Outlook of the Market