Capital Spending on Memory Devices Market

By Type;

DRAM, Mobile DRAM, NAND Flash, and 3D NAND Flash

By Memory Density;

Low-Density Memory and High-Density Memory

By Application;

Consumer Electronics and Automotive

By End-Users;

Mobile Devices and Computing Devices

By Geography;

North America, Europe, Asia Pacific, Middle East & Africa, and Latin America - Report Timeline (2021 - 2031)
Report ID: Rn845101178 Published Date: June, 2025 Updated Date: August, 2025

Capital Spending on Memory Devices Market Overview

Capital Spending on Memory Devices Market (USD Million)

Capital Spending on Memory Devices Market was valued at USD 124020.37 million in the year 2024. The size of this market is expected to increase to USD 186480.78 million by the year 2031, while growing at a Compounded Annual Growth Rate (CAGR) of 6.0%.


Capital Spending on Memory Devices Market

*Market size in USD million

CAGR 6.0 %


Study Period2025 - 2031
Base Year2024
CAGR (%)6.0 %
Market Size (2024)USD 124020.37 Million
Market Size (2031)USD 186480.78 Million
Market ConcentrationMedium
Report Pages380
124020.37
2024
186480.78
2031

Major Players

  • Samsung Electronics
  • SK Hynix
  • Micron Technology
  • Intel Corporation
  • Taiwan Semiconductor Manufacturing Company (TSMC)
  • Western Digital
  • Kioxia Corporation (formerly Toshiba Memory Corporation)
  • Nanya Technology
  • Winbond Electronics
  • Powerchip Technology

Market Concentration

Consolidated - Market dominated by 1 - 5 major players

Capital Spending on Memory Devices Market

Fragmented - Highly competitive market without dominant players


The Capital Spending on Memory Devices Market is advancing significantly, with over 55% of vendors investing in DRAM and NAND expansion lines. This wave unlocks strong opportunities for tool providers to supply EUV systems, high‑throughput deposition, and metrology platforms. Foundries are employing smart strategies to optimize production yields, accelerate time‑to‑market, and strengthen supply resilience—fuelling scalable growth and enabling extensive expansion of memory capacity.

Next‑Gen Innovation in Equipment Upgrades
Roughly 50% of capex now flows into EUV, 3D IC stacking, and advanced packaging modules—highlighting major technological advancements. These innovations enable denser chips, tighter process control, and greater power efficiency. Manufacturers are integrating AI‑powered fab analytics and inline measurement systems to embed continuous innovation and support expansion of cleanroom environments.

Strategic Collaboration for Fab Efficiency
More than 58% of capex programs feature partnerships among memory producers, tool OEMs, and materials suppliers. These collaborations create aligned spec sheets, rapid prototyping, and shared development risk. Through joint roadmap planning, stakeholders reinforce a strong future outlook and accelerate capacity deployment cycles.

Future Outlook Anchored in Green‑Ready, Modular Fabs
Nearly 53% of plans include investments in smart fab architecture with modular layouts, remote monitoring, and renewable power systems. This promising future outlook caters to surging demand from AI, automotive, and cloud sectors. These strategic investments foster ongoing innovation, enhance facility agility, and facilitate expansive expansion of global memory production.

  1. Introduction
    1. Research Objectives and Assumptions
    2. Research Methodology
    3. Abbreviations
  2. Market Definition & Study Scope
  3. Executive Summary
    1. Market Snapshot, By Type
    2. Market Snapshot, By Memory Density
    3. Market Snapshot, By Application
    4. Market Snapshot, By End-User
    5. Market Snapshot, By Region
  4. Capital Spending on Memory Devices Market Dynamics
    1. Drivers, Restraints and Opportunities
      1. Drivers
        1. Technological Advancements
        2. Growing Data Center Demand
        3. Increasing Consumer Electronics Usage
        4. Cloud Computing Expansion
        5. AI and IoT Integration
      2. Restraints
        1. Supply Chain Disruptions
        2. Fluctuating Market Demand
        3. Cost and Margin Pressures
        4. Regulatory Challenges
        5. Technology Obsolescence Risks
      3. Opportunities
        1. 5G Network Expansion
        2. Emerging Memory Technologies
        3. Edge Computing Developments
        4. AI-driven Applications
        5. Smart Manufacturing Growth
    2. PEST Analysis
      1. Political Analysis
      2. Economic Analysis
      3. Social Analysis
      4. Technological Analysis
    3. Porter's Analysis
      1. Bargaining Power of Suppliers
      2. Bargaining Power of Buyers
      3. Threat of Substitutes
      4. Threat of New Entrants
      5. Competitive Rivalry
  5. Market Segmentation
    1. Capital Spending on Memory Devices Market, By Type, 2021- 2031 (USD Million)
      1. DRAM
      2. Mobile DRAM
      3. NAND Flash
      4. 3D NAND Flash
    2. Capital Spending on Memory Devices Market, By Memory Density, 2021- 2031 (USD Million)

      1. Low-Density Memory

      2. High-Density Memory

    3. Capital Spending on Memory Devices Market, By Application, 2021- 2031 (USD Million)

      1. Consumer Electronics

      2. Automotive

    4. Capital Spending on Memory Devices Market, By End-User, 2021- 2031 (USD Million)
      1. Mobile Devices
      2. Computing Devices
    5. Capital Spending on Memory Devices Market, By Geography, 2021- 2031 (USD Million)
      1. North America
        1. United States
        2. Canada
      2. Europe
        1. Germany
        2. United Kingdom
        3. France
        4. Italy
        5. Spain
        6. Nordic
        7. Benelux
        8. Rest of Europe
      3. Asia Pacific
        1. Japan
        2. China
        3. India
        4. Australia & New Zealand
        5. South Korea
        6. ASEAN (Association of South East Asian Countries)
        7. Rest of Asia Pacific
      4. Middle East & Africa
        1. GCC
        2. Israel
        3. South Africa
        4. Rest of Middle East & Africa
      5. Latin America
        1. Brazil
        2. Mexico
        3. Argentina
        4. Rest of Latin America
  6. Competitive Landscape
    1. Company Profiles
      1. Samsung Electronics
      2. SK Hynix
      3. Micron Technology
      4. Intel Corporation
      5. Taiwan Semiconductor Manufacturing Company (TSMC)
      6. Western Digital
      7. Kioxia Corporation (formerly Toshiba Memory Corporation)
      8. Nanya Technology
      9. Winbond Electronics
      10. Powerchip Technology
  7. Analyst Views
  8. Future Outlook of the Market