Capillary Underfill Material Market

By Product;

Molded Underfill Material, No Flow Underfill Material, and Others

By Material Type;

Quartz / Silicone, Alumina Based, Epoxy Based, Urethane Based, Acrylic Based, and Others

By Application;

Chip Scale Packaging, Flip Chips, Ball Grid Array, and Others

By Geography;

North America, Europe, Asia Pacific, Middle East & Africa, and Latin America - Report Timeline (2021 - 2031)
Report ID: Rn315519093 Published Date: August, 2025 Updated Date: September, 2025

Capillary Underfill Material Market Overview

Capillary Underfill Material Market (USD Million)

Capillary Underfill Material Market was valued at USD 277.38 million in the year 2024. The size of this market is expected to increase to USD 475.37 million by the year 2031, while growing at a Compounded Annual Growth Rate (CAGR) of 8.0%.


Capillary Underfill Material Market

*Market size in USD million

CAGR 8.0 %


Study Period2025 - 2031
Base Year2024
CAGR (%)8.0 %
Market Size (2024)USD 277.38 Million
Market Size (2031)USD 475.37 Million
Market ConcentrationMedium
Report Pages352
277.38
2024
475.37
2031

Major Players

  • Zymet
  • Epoxy Technology Inc
  • Henkel Ag & Co. Kg
  • Namics Corporation
  • Nordson Corporation

Market Concentration

Consolidated - Market dominated by 1 - 5 major players

Capillary Underfill Material Market

Fragmented - Highly competitive market without dominant players


The capillary underfill material market is witnessing notable growth as demand for advanced semiconductor packaging solutions continues to rise. Over 50% of adoption is linked to flip-chip packaging, where these materials deliver structural integrity and enhance reliability. Their role in protecting devices from thermal and mechanical stress is making them indispensable.

Rising Adoption in Consumer Electronics
More than 45% of utilization comes from consumer electronics, where capillary underfill materials enhance durability, performance, and stability of compact devices. Their ability to ensure uniform adhesion supports the increasing miniaturization trend in smartphones, wearables, and other portable technologies.

Innovations in Material Technology
Recent progress in resin formulations, nanomaterials, and process optimization has advanced the capabilities of underfill materials. Nearly 35% of new solutions emphasize better thermal properties and faster curing, improving manufacturing efficiency. These technological upgrades are strengthening their role in semiconductor packaging.

Applications in High-Performance Electronics
Over 40% of demand originates from sectors like telecommunications, high-performance computing, and automotive electronics. The use of capillary underfill ensures device reliability and extended operational life in applications where performance and durability are critical. This reflects their expanding influence in high-value industries.

Market Outlook and Opportunities
The capillary underfill material market is set for continued expansion, with around 38% of investments focusing on eco-friendly and advanced materials. As semiconductor technologies evolve further, these materials will remain central to enabling efficiency, stability, and innovation in next-generation electronics.

  1. Introduction
    1. Research Objectives and Assumptions
    2. Research Methodology
    3. Abbreviations
  2. Market Definition & Study Scope
  3. Executive Summary
    1. Market Snapshot, By Product
    2. Market Snapshot, By Material Type
    3. Market Snapshot, By Application
    4. Market Snapshot, By Region
  4. Capillary Underfill Material Market Dynamics
    1. Drivers, Restraints and Opportunities
      1. Drivers
        1. Natural Product Demand
        2. Health Benefits Recognition
        3. Food Industry Adoption
      2. Restraints
        1. Raw Material Price Volatility
        2. Regulatory Challenges
        3. Limited Awareness in New Markets
      3. Opportunities
        1. Diverse Applications
        2. Asia-Pacific Growth
        3. Sustainability Trends
    2. PEST Analysis
      1. Political Analysis
      2. Economic Analysis
      3. Social Analysis
      4. Technological Analysis
    3. Porter's Analysis
      1. Bargaining Power of Suppliers
      2. Bargaining Power of Buyers
      3. Threat of Substitutes
      4. Threat of New Entrants
      5. Competitive Rivalry
  5. Market Segmentation
    1. Capillary Underfill Material Market, By Product, 2021 - 2031 (USD Million)
      1. Molded Underfill Material
      2. No Flow Underfill Material
      3. Others
    2. Capillary Underfill Material Market, By Mterial Type, 2021 - 2031 (USD Million)
      1. Quartz / Silicone
      2. Alumina Based
      3. Epoxy Based
      4. Urethane Based
      5. Acrylic Based
      6. Others
    3. Capillary Underfill Material Market, By Application, 2021 - 2031 (USD Million)
      1. Chip Scale Packaging
      2. Flip Chips
      3. Ball Grid Array
      4. Others
    4. Capillary Underfill Material Market, By Geography, 2021 - 2031 (USD Million)
      1. North America
        1. United States
        2. Canada
      2. Europe
        1. Germany
        2. United Kingdom
        3. France
        4. Italy
        5. Spain
        6. Nordic
        7. Benelux
        8. Rest of Europe
      3. Asia Pacific
        1. Japan
        2. China
        3. India
        4. Australia & New Zealand
        5. South Korea
        6. ASEAN (Association of South East Asian Countries)
        7. Rest of Asia Pacific
      4. Middle East & Africa
        1. GCC
        2. Israel
        3. South Africa
        4. Rest of Middle East & Africa
      5. Latin America
        1. Brazil
        2. Mexico
        3. Argentina
        4. Rest of Latin America
  6. Competitive Landscape
    1. Company Profiles
      1. Zymet
      2. Epoxy Technology Inc
      3. Henkel Ag & Co. Kg
      4. Namics Corporation
      5. Nordson Corporation
  7. Analyst Views
  8. Future Outlook of the Market