Automotive Power Module Packaging Market

By Type;

Intelligent Power Module (IPM), Sic Module, Gan Module, and Others

By Material Type;

Ceramics, Metals, and Polymers

By Vehicle Type;

Passenger Cars and Commercial Vehicles

By Application;

Electric Vehicles, Hybrid Vehicles, and Conventional Vehicles

By Geography;

North America, Europe, Asia Pacific, Middle East & Africa, and Latin America - Report Timeline (2021 - 2031)
Report ID: Rn968859613 Published Date: August, 2025 Updated Date: September, 2025

Automotive Power Module Packaging Market Overview

Automotive Power Module Packaging Market (USD Million)

Automotive Power Module Packaging Market was valued at USD 2340.43 million in the year 2024. The size of this market is expected to increase to USD 5173.95 million by the year 2031, while growing at a Compounded Annual Growth Rate (CAGR) of 12.0%.


Automotive Power Module Packaging Market

*Market size in USD million

CAGR 12.0 %


Study Period2025 - 2031
Base Year2024
CAGR (%)12.0 %
Market Size (2024)USD 2340.43 Million
Market Size (2031)USD 5173.95 Million
Market ConcentrationLow
Report Pages398
2340.43
2024
5173.95
2031

Major Players

  • Amkor Technology
  • Kulicke and Soffa Industries Inc
  • PTI Technology Inc
  • Infineon Technologies
  • STMicroelectronics
  • Fuji Electric Co. Ltd
  • Toshiba Electronic Device & Storage Corporation
  • Semikron
  • STATS ChipPAC Ltd. (JCET)
  • Starpower Semiconductor Ltd

Market Concentration

Consolidated - Market dominated by 1 - 5 major players

Automotive Power Module Packaging Market

Fragmented - Highly competitive market without dominant players



The Automotive Power Module Packaging Market is gaining strong momentum due to the rapid adoption of electric and hybrid vehicles. As power electronics serve as the backbone of vehicle electrification, efficient packaging solutions are becoming crucial for improved performance and reliability. Currently, more than 55% of electric vehicle efficiency improvements are attributed to advancements in power module packaging, highlighting its critical role in the industry.

Growing Demand for High-Efficiency Systems
The demand for high-efficiency systems in modern vehicles has accelerated the integration of advanced packaging technologies. Approximately 60% of thermal and electrical losses in power modules can be reduced through innovative packaging solutions. This shift is directly supporting higher energy efficiency, longer battery life, and enhanced system durability, making packaging a key enabler for next-generation mobility solutions.

Advancements in Thermal Management
One of the most important drivers in this market is the focus on thermal management. With nearly 50% of module failures linked to overheating, manufacturers are investing heavily in packaging solutions that ensure efficient heat dissipation. Advanced materials and compact designs are allowing modules to withstand higher power densities, thereby improving safety and reliability in electric vehicles.

Focus on Miniaturization and Durability
Another trend shaping this market is the increasing emphasis on miniaturization and durability. Around 45% of automotive power modules now feature compact packaging without compromising performance. These developments not only reduce overall vehicle weight but also enhance long-term durability, meeting the industry’s push toward lightweight and energy-efficient components.

  1. Introduction
    1. Research Objectives and Assumptions
    2. Research Methodology
    3. Abbreviations
  2. Market Definition & Study Scope
  3. Executive Summary
    1. Market Snapshot, By Type
    2. Market Snapshot, By Material Type
    3. Market Snapshot, By Vehicle Type
    4. Market Snapshot, By Application
    5. Market Snapshot, By Region
  4. Automotive Power Module Packaging Market Dynamics
    1. Drivers, Restraints and Opportunities
      1. Drivers
        1. Technological Advancements in Electric Vehicles
        2. Stringent Regulations for Emission Control
        3. Rising Consumer Awareness about Sustainability
      2. Restraints
        1. High Initial Investment Costs
        2. Complexity in Integration
        3. Limited Infrastructure for Electric Vehicles
      3. Opportunities
        1. Emerging Markets for Electric Vehicles
        2. Collaborations and Partnerships
        3. Focus on Lightweight Materials
    2. PEST Analysis
      1. Political Analysis
      2. Economic Analysis
      3. Social Analysis
      4. Technological Analysis
    3. Porter's Analysis
      1. Bargaining Power of Suppliers
      2. Bargaining Power of Buyers
      3. Threat of Substitutes
      4. Threat of New Entrants
      5. Competitive Rivalry
  5. Market Segmentation
    1. Automotive Power Module Packaging Market, By Type, 2021 - 2031 (USD Million)
      1. Intelligent Power Module (IPM)
      2. Sic Module
      3. Gan Module
      4. Others
    2. Automotive Power Module Packaging Market, By Material Type, 2021 - 2031 (USD Million)

      1. Ceramics

      2. Metals

      3. Polymers

    3. Automotive Power Module Packaging Market, By Vehicle Type, 2021 - 2031 (USD Million)
      1. Passenger Cars
      2. Commercial Vehicles
    4. Automotive Power Module Packaging Market, By Application, 2021 - 2031 (USD Million)
      1. Electric Vehicles
      2. Hybrid Vehicles
      3. Conventional Vehicles
    5. Automotive Power Module Packaging Market, By Geography, 2021 - 2031 (USD Million)
      1. North America
        1. United States
        2. Canada
      2. Europe
        1. Germany
        2. United Kingdom
        3. France
        4. Italy
        5. Spain
        6. Nordic
        7. Benelux
        8. Rest of Europe
      3. Asia Pacific
        1. Japan
        2. China
        3. India
        4. Australia & New Zealand
        5. South Korea
        6. ASEAN (Association of South East Asian Countries)
        7. Rest of Asia Pacific
      4. Middle East & Africa
        1. GCC
        2. Israel
        3. South Africa
        4. Rest of Middle East & Africa
      5. Latin America
        1. Brazil
        2. Mexico
        3. Argentina
        4. Rest of Latin America
  6. Competitive Landscape
    1. Company Profiles
      1. Amkor Technology
      2. Kulicke and Soffa Industries Inc
      3. PTI Technology Inc
      4. Infineon Technologies
      5. STMicroelectronics
      6. Fuji Electric Co. Ltd
      7. Toshiba Electronic Device & Storage Corporation
      8. Semikron
      9. STATS ChipPAC Ltd. (JCET)
      10. Starpower Semiconductor Ltd
  7. Analyst Views
  8. Future Outlook of the Market