Global Radiation Hardened Electronics And Semiconductors Market Growth, Share, Size, Trends and Forecast (2024 - 2030)

By Component;

Processors & Controllers, Logic, Memory, Power Management, ASICs, and FPGAs.

By Manufacturing Technique;

RHBP and RHBD.

By Application;

Aerospace & Defense and Space.

By Geography;

North America, Europe, Asia Pacific, Middle East and Africa and Latin America - Report Timeline (2020 - 2030).
Report ID: Rn676638508 Published Date: March, 2024 Updated Date: April, 2024

Introduction

Global Radiation Hardened Electronics And Semiconductors Market (USD Million), 2020 - 2030

In the year 2023, the Global Radiation Hardened Electronics And Semiconductors Market was valued at USD 1,536.02 million. The size of this market is expected to increase to USD 1,878.83 million by the year 2030, while growing at a Compounded Annual Growth Rate (CAGR) of 2.9%.

Radiation hardening is a critical technique employed in electronics and semiconductor devices to render them resistant to damage caused by radiation. Particularly crucial in high-altitude applications where radiation exposure poses a significant risk to electronic components, radiation-hardened devices find extensive use in sectors such as aerospace and defense, especially in satellite systems, power supplies, switching regulators, and microprocessors for military and space applications. These specialized components are essential for preventing damage from gamma radiation and neutron radiation, particularly in environments like nuclear reactors.

The market for radiation-hardened electronics and semiconductors is witnessing growth driven by increasing demand, particularly from the communication satellites segment, and the rising number of space missions undertaken by various countries. However, challenges persist, including the creation of realistic testing environments and manufacturing and design complexities, which hinder the market's growth potential. Nevertheless, there are opportunities emerging from growing research and development activities at various space stations and the rising demand from commercial and military applications, which contribute to the market's expansion.

The world radiation-hardened electronics and semiconductors market is categorized based on components, manufacturing techniques, applications, and geographical regions. Key components covered include processors & controllers, logic, memory, power management, ASICs, and FPGAs. Manufacturing techniques include RHBP and RHBD, while applications encompass aerospace & defense and space sectors. Geographically, the market spans North America, Asia-Pacific, Europe, and Latin America, Middle East, and Africa (LAMEA). Leading companies in the market, such as Honeywell Aerospace, BAE Systems, and Microsemi Corporation, employ various strategies like new product launches, collaborations, mergers & acquisitions, and expansions to strengthen their market position and meet the growing demand for radiation-hardened electronics and semiconductors.

  1. Introduction
    1. Research Objectives and Assumptions
    2. Research Methodology
    3. Abbreviations
  2. Market Definition & Study Scope
  3. Executive Summary
    1. Market Snapshot, By Component
    2. Market Snapshot, By Manufacturing Technique
    3. Market Snapshot, By Application
    4. Market Snapshot, By Region
  4. Global Radiation Hardened Electronics And Semiconductors Market Dynamics
    1. Drivers, Restraints and Opportunities
      1. Drivers:
        1. Research and Development Efforts
        2. Aerospace and Defense Sector Growth
        3. Regulatory Standards and Compliance
      2. Restraints:
        1. Cost Constraints
        2. Manufacturing and Design Challenges
        3. Testing Environment Limitations
      3. Opportunities:
        1. Growing R&D Activities
        2. Commercial and Military Applications
        3. Increasing Demand for Space Missions
    2. PEST Analysis
      1. Political Analysis
      2. Economic Analysis
      3. Social Analysis
      4. Technological Analysis
    3. Porter's Analysis
      1. Bargaining Power of Suppliers
      2. Bargaining Power of Buyers
      3. Threat of Substitutes
      4. Threat of New Entrants
      5. Competitive Rivalry
  5. Market Segmentation
    1. Global Radiation Hardened Electronics And Semiconductors Market, By Component, 2022 - 2032 (USD Million)
      1. Processors & Controllers
      2. Logic
      3. Memory
      4. Power Management
      5. ASICs
      6. FPGAs
    2. Global Radiation Hardened Electronics And Semiconductors Market, By Manufacturing Technique, 2022 - 2032 (USD Million)
      1. RHBP
      2. RHBD
    3. Global Radiation Hardened Electronics And Semiconductors Market, By Application, 2022 - 2032 (USD Million)
      1. Aerospace & Defense
      2. Space
    4. Global Radiation Hardened Electronics And Semiconductors Market, By Geography, 2022 - 2032 (USD Million)
      1. North America
        1. United States
        2. Canada
      2. Europe
        1. Germany
        2. United Kingdom
        3. France
        4. Italy
        5. Spain
        6. Nordic
        7. Benelux
        8. Rest of Europe
      3. Asia Pacific
        1. Japan
        2. China
        3. India
        4. Australia & New Zealand
        5. South Korea
        6. ASEAN (Association of South East Asian Countries)
        7. Rest of Asia Pacific
      4. Middle East & Africa
        1. GCC
        2. Israel
        3. South Africa
        4. Rest of Middle East & Africa
      5. Latin America
        1. Brazil
        2. Mexico
        3. Argentina
        4. Rest of Latin America
  6. Competitive Landscape
    1. Company Profiles
      1. Honeywell Aerospace
      2. BAE Systems
      3. Microsemi Corporation
      4. Xilinx Incorporation
      5. Texas Instruments
      6. Maxwell Technologies
      7. Intersil Corporation
      8. Atmel Corporation
      9. Linear Technology Corporation
      10. ST Microelectronics
  7. Analyst Views
  8. Future Outlook of the Market

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